參數(shù)資料
型號(hào): AM70PDL9BDH66IT
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
中文描述: 堆疊式多芯片封裝(MCP / XIP)的快閃記憶體,數(shù)據(jù)存儲(chǔ)的MirrorBit閃存和移動(dòng)存儲(chǔ)芯片(XIP)的
文件頁數(shù): 126/128頁
文件大?。?/td> 916K
代理商: AM70PDL9BDH66IT
124
Am70PDL127BDH/Am70PDL129BDH
November 25, 2003
A D V A N C E I N F O R M A T I O N
REVISION SUMMARY
Revision A (August 7, 2003)
Initial release.
Revision A+1 (September 3, 2003)
Connection Diagrams
Corrected ball grid labels for balls K9 and L7–L9 on
both Am70PDL127BDH and Am70PDL129BDH con-
nection diagrams.
Revision A+2 (November 13, 2003)
ESD
Added ESD disclaimer.
Connection Diagram
Updated pinout.
Revision A+3 (November 25, 2003)
SecSi (Secured Silicon) Sector Flash Memory
Region
Customer-Lockable Area:Added sector protection fig-
ure and changed figure reference in this section from
Figure 1 to Figure 4.
Figure 17
, Sector Protection Command Definitions
Corrected number of cycles for SecSi Protection Bit
Status, PPMLB Status, and SPMLB Status from 4 to 5
cycles. For these command sequences, inserted a
cycle before the final read cycle (RD0).
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AM70PDL9BDH85IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
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