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參數(shù)資料
| 型號： | Am50DL128BG85I |
| 廠商： | Advanced Micro Devices, Inc. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; No. of Contacts:128; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM |
| 文件頁數(shù)： | 64/64頁 |
| 文件大?。?/td> | 974K |
| 代理商： | AM50DL128BG85I |
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January 8, 2003
Am50DL128BG
63
P R E L I M I N A R Y
REVISION SUMMARY
Revision A (March 8, 2002)
Initial release.
Revision A+1 (March 20, 2002)
Physical Dimensions
Drawing, tables, and notes were replaced with up-
dated versions.
Revision A+2 (December 11, 2002)
Distinctive Characteristics
Corrected cycle specifications per sector.
Pin Description
Added CE#1s and CE2s description.
Table 12. Am29DL640G Command Definitions
Changed the first address of the unlock bypass reset
command sequence from BA to XXX.
Customer Lockable: SecSi Sector NOT
Programmed or Protected at the factory.
Added second bullet, SecSi sector-protect verify text
and figure 3.
Common Flash Memory Interface (CFI)
Changed wording in last sentence of third paragraph
from, “...the autoselect mode.” to “...reading array
data.”
Changed CFI website address.
Command Definitions
Changed wording in last sentence of first paragraph
from, “...resets the device to reading array data.” to
...”may place the device to an unknown state. A reset
command is then required to return the device to read-
ing array data.”
Byte/Word Program Command Sequence, Sector
Erase Command Sequence, and Chip Erase Com-
mand Sequence
Noted
that the SecSi Sector, autoselect, and CFI func-
tions are unavailable when a program or erase opera-
tion is in progress.
CMOS Compatible
Removed I
ACC
parameter from table.
Added I
LR
parameter to table.
Added note #7.
Read-Only Operations
Changed t
EHQZ
and t
GHQZ
speeds to 16 ns.
Word/Byte Configuration
Changed t
FLQZ
speeds to 16 ns.
Revision A+3 (January 8, 2003)
Global
Corrected publication number to 26089.
Physical Dimensions
Deleted maximum A1 specification in table.
Trademarks
Copyright 2003 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
ExpressFlash is a trademark of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| AM50DL128BH | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM50DL128BH_04 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Two Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories |
| AM50DL128BH56I | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM50DL128BH56IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Two Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories |
| AM50DL128BH56IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Two Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories |
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