參數(shù)資料
型號(hào): AM49DL324BGT85
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
中文描述: 堆疊式多芯片封裝(MCP)閃存和SRAM的32兆位(4個(gè)M × 8位/ 2米x 16位),3.0伏的CMOS只,同時(shí)
文件頁數(shù): 7/64頁
文件大?。?/td> 570K
代理商: AM49DL324BGT85
6
Am49DL32xBG
July 19, 2002
P R E L I M I N A R Y
FLASH MEMORY BLOCK DIAGRAM
V
CC
V
SS
Upper Bank Address
A20
A0
RESET#
WE#
CE#
CIOf
DQ15
DQ0
WP#/ACC
STATE
CONTROL
&
COMMAND
REGISTER
RY/BY#
Upper Bank
X-Decoder
Y
L
OE# CIOf
DQ15
DQ0
Lower Bank
Y
X-Decoder
L
Lower Bank Address
OE#
CIOf
Status
Control
A20
A0
A20
A0
A
A
A
A
D
D
D
D
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AM49DL32XBG 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Am49DL32xBG - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM49DL32XBGB70IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
AM49DL32XBGB70IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous