型號(hào): | AM45DL3208GB70IT |
廠商: | ADVANCED MICRO DEVICES INC |
元件分類(lèi): | 存儲(chǔ)器 |
英文描述: | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
中文描述: | SPECIALTY MEMORY CIRCUIT, PBGA73 |
封裝: | 8 X 11.60 MM, FBGA-73 |
文件頁(yè)數(shù): | 1/66頁(yè) |
文件大?。?/td> | 1196K |
代理商: | AM45DL3208GB70IT |
相關(guān)PDF資料 |
PDF描述 |
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AM45DL3208GB85IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
AM45DL3208GB85IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
AM45DL3208GT70IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
AM45DL3208GT70IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
AM45DL3208GT85IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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AM45DL3208GB85IS | 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
AM45DL3208GB85IT | 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
AM45DL3208GT70IS | 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
AM45DL3208GT70IT | 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
AM45DL3208GT85IS | 制造商:AMD 制造商全稱(chēng):Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |