
March 3, 2005
41
A d v a n c e I n f o r m a t i o n
Revision Summary
Revision A (August 14, 2002)
Initial Release.
Revision A+1 (August 28, 2002)
Sector Protection/Unprotection
Changed beginning of second paragraph from, “The
primary method....” to read, “Sector protection/un-
protection.”
Deleted third paragraph.
FBB048—48-Ball Fine-Pitch Ball Grid Array (FBGA)
6 x 8 mm package
Changed number in row D in table from 9.00 mm to
8.0 mm.
Revision A + 2 (February 5, 2003)
Global
Changed fastest speed option from 103 ns to 100 ns,
regulated voltage, added 110 ns speed option stan-
dard voltage.
General Description
Changed first sentenced to indicate 48-pin TSOP
package option.
Command Definitions, Table 5
Removed TBD markers from device ID, Top Boot
Block to 70h.
Removed TBD markers from device ID, Bottom Boot
Block to FIh.
Changed address bits A18
–
A11 to A17
–
A11.
Physical Dimensions, 48-pin TSOP
Changed from Reverse to Standard TSOP package.
Revision A + 3 (February 26, 2003)
Global
Added 110 ns speed option.
Distinctive Characteristics
Updated Automatic Sleep Mode and standby mode
current values.
Pin Configuration
Updated V
CC
low-end value.
Ordering Information
Changed WB package type to WA.
DC Characteristics, CMOS Compatible
Updated V
CC
Standby and Reset currents Typ values,
and Automatic Sleep Mode Typ value.
Revision A+ 4 (March 18, 2003)
Ordering Information, Valid Combinations
Removed dashes from Order Numbers.
Revision A + 5 (March 3, 2005)
Ordering Information
Added Commercial and Industrial Pb-free Package
temperatures.
Valid Combinations for TSOP package
Added two package codes
Valid Combination for FBGA package
Added two package codes
Global
Added Colophon.
Updated Trademark information.