參數(shù)資料
型號(hào)： AM29PL160CB-90EI
英文描述： 5-SOT23, Pb/HALO FREE, 1.8V(SERIAL EE)
中文描述： x8/x16閃存EEPROM
文件頁數(shù)： 64/67頁
文件大?。?/td> 635K
代理商： AM29PL160CB-90EI
62
Am29PDL129H
August 8, 2003
P R E L I M I N A R Y
PHYSICAL DIMENSIONS
VBB080—80-Ball Fine-pitch Ball Grid Array 11.5 x 9 mm package
3233 \ 16-038.9h
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
PACKAGE
VBB 080
JEDEC
N/A
11.50 mm x 9.00 mm NOM
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.00
OVERALL THICKNESS
A1
0.20
---
---
BALL HEIGHT
A2
0.62
---
0.76
BODY THICKNESS
D
11.50 BSC.
BODY SIZE
E
9.00 BSC.
BODY SIZE
D1
8.80 BSC.
BALL FOOTPRINT
E1
5.60 BSC.
BALL FOOTPRINT
MD
12
ROW MATRIX SIZE D DIRECTION
ME
8
ROW MATRIX SIZE E DIRECTION
N
φ
b
e
80
TOTAL BALL COUNT
0.30
0.35
0.40
BALL DIAMETER
0.80 BSC.
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
(A3-A6, B3-B6, L3-L6, -M3-M6) DEPOPULATED SOLDER BALLS
BOTTOM VIEW
TOP VIEW
SIDE VIEW
A1 CORNER
A2
A
INDEX MARK
CORNER
10
PIN A1
M
L
J
K
e
C
0.05
(2X)
(2X)
C
0.05
A1
E
D
7
B
A
C
E
D
F
H
G
8
7
6
5
4
3
2
1
e
D1
E1
SE
7
B
C A
C
M
φ
0.15
φ
0.08 M
6
0.10 C
C
0.08
NX
φ
b
SD
A
B
C
SEATING PLANE
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