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    參數(shù)資料
    型號: Am29LV641DU121RFEN
    廠商: Advanced Micro Devices, Inc.
    英文描述: 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only Uniform Sector Flash Memory with VersatileI Control
    中文描述: 64兆位(4個M x 16位),3.0伏的CMOS只均勻部門閃光控制記憶與VersatileI
    文件頁數(shù): 4/57頁
    文件大小: 1467K
    代理商: AM29LV641DU121RFEN
    September 20, 2002
    Am29LV640D/Am29LV641D
    3
    TABLE OF CONTENTS
    Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
    Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
    Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5
    Special Handling Instructions for FBGA/
    f
    BGA Packages .........8
    Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
    Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
    Ordering Information . . . . . . . . . . . . . . . . . . . . . .10
    Device Bus Operations . . . . . . . . . . . . . . . . . . . . .11
    Table 1. Device Bus Operations .....................................................11
    VersatileIO
    (V
    IO
    ) Control .....................................................11
    Requirements for Reading Array Data ...................................11
    Writing Commands/Command Sequences ............................12
    Accelerated ProgramOperation ......................................................12
    Autoselect Functions .......................................................................12
    Standby Mode ........................................................................12
    Automatic Sleep Mode ...........................................................12
    RESET#: Hardware Reset Pin ...............................................12
    Output Disable Mode ..............................................................13
    Table 2. Sector Address Table ........................................................13
    Autoselect Mode .....................................................................17
    Table 3. Autoselect Codes, (High Voltage Method) .......................17
    Sector Group Protection and Unprotection .............................18
    Table 4. Sector Group Protection/Unprotection Address Table .....18
    Write Protect (WP#) ................................................................19
    Temporary Sector Group Unprotect .......................................19
    Figure 1. Temporary Sector Group UnprotectOperation................ 19
    Figure 2. In-SystemSector Group Protect/UnprotectAlgorithms... 20
    SecSi (Secured Silicon) Sector Flash MemoryRegion ..........21
    Table 5. SecSi Sector Contents ......................................................21
    Hardware Data Protection ......................................................21
    Low VCC Write Inhibit .....................................................................21
    Write Pulse “Glitch” Protection ........................................................22
    Logical Inhibit ..................................................................................22
    Power-Up Write Inhibit ....................................................................22
    Common Flash Memory Interface (CFI). . . . . . . 22
    Table 6. CFI Query Identification String.......................................... 22
    SystemInterface String................................................................... 23
    Table 8. Device Geometry Definition.............................................. 23
    Table 9. Primary Vendor-Specific Extended Query........................ 24
    Command Definitions . . . . . . . . . . . . . . . . . . . . . 24
    Reading Array Data ................................................................24
    Reset Command .....................................................................25
    Autoselect Command Sequence ............................................25
    Enter SecSi Sector/Exit SecSi Sector CommandSequence ..25
    Word ProgramCommand Sequence .....................................25
    Unlock Bypass Command Sequence ..............................................26
    Figure 3. ProgramOperation.......................................................... 26
    Chip Erase Command Sequence ...........................................26
    Sector Erase Command Sequence ........................................27
    Erase Suspend/Erase Resume Commands ...........................27
    Figure 4. Erase Operation............................................................... 28
    Command Definitions .............................................................29
    Command Definitions...................................................................... 29
    Write Operation Status . . . . . . . . . . . . . . . . . . . . .30
    DQ7: Data#Polling .................................................................30
    Figure 5. Data#Polling Algorithm................................................... 30
    RY/BY#: Ready/Busy#............................................................31
    DQ6: Toggle Bit I ....................................................................31
    Figure 6. Toggle Bit Algorithm........................................................ 31
    DQ2: Toggle Bit II ...................................................................32
    Reading Toggle Bits DQ6/DQ2 ...............................................32
    DQ5: Exceeded Timng Limts ................................................32
    DQ3: Sector Erase Timer .......................................................32
    Table 11. Write Operation Status ...................................................33
    Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34
    Figure 7. MaximumNegative OvershootWaveform..................... 34
    Figure 8. MaximumPositive OvershootWaveform....................... 34
    Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34
    DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
    Figure 9. I
    CC1
    Current vs. Time (Showing
    ActiveandAutomaticSleepCurrents)........................................... 36
    Figure 10. Typical I
    vs. Frequency............................................ 36
    Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37
    Figure 11. Test Setup.................................................................... 37
    Table 12. Test Specifications .........................................................37
    Key to Switching Waveforms. . . . . . . . . . . . . . . . 37
    Figure 12. Input Waveforms and
    Measurement Levels...................................................................... 37
    AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
    Read-Only Operations ...........................................................38
    Figure 13. Read Operation Timngs............................................... 38
    Hardware Reset (RESET#) ....................................................39
    Figure 14. Reset Timngs............................................................... 39
    Erase and ProgramOperations ..............................................40
    Figure 15. ProgramOperation Timngs.......................................... 41
    Figure 16. Accelerated ProgramTimng Diagram.......................... 41
    Figure 17. Chip/Sector Erase Operation Timngs.......................... 42
    Figure 18. Data# Polling Timngs
    (During Embedded Algorithms)...................................................... 43
    Figure 19. Toggle Bit Timngs
    (During Embedded Algorithms)...................................................... 44
    Figure 20. DQ2 vs. DQ6................................................................. 44
    Temporary Sector Unprotect ..................................................45
    Figure 21. Temporary Sector Group Unprotect TimngDiagram... 45
    Figure 22. Sector Group Protect and Unprotect TimngDiagram.. 46
    Alternate CE#Controlled Erase and ProgramOperations .....47
    Figure 23. Alternate CE#Controlled Write
    (Erase/Program OperationTimngs.............................................. 48
    Erase And Programming Performance . . . . . . . 49
    Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 49
    TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 49
    Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
    Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 50
    SSO056
    56-Pin Shrink Small Outline Package (SSOP) ......50
    FBE063
    63-Ball Fine-Pitch Ball Grid Array
    (FBGA) 12x11mmpackage .................................................51
    LAA064
    64-Ball Fortified Ball Grid Array
    (
    F
    BGA) 13x11mmpackage .................................................52
    TS 048
    48-Pin Standard TSOP ............................................53
    TSR048
    48-Pin Reverse TSOP ...........................................54
    Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55
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