
2
Am29LV200B
21521D6  October 10, 2006
  DA T A  S HE E T
GENERAL DESCRIPTION
The Am29LV200B is a 2 Mbit, 3.0 volt-only Flash 
memory organized as 262,144 bytes or 131,072 words. 
The device is offered in 44-pin SO, 48-pin TSOP, and 48-
ball FBGA packages. The word-wide data (x16) appears 
on DQ15-DQ0; the byte-wide (x8) data appears on 
DQ7-DQ0. This device is designed to be programmed 
in-system using only a single 3.0 volt V
CC
 supply. No 
V
PP
 is required for write or erase operations. The device 
can also be programmed in standard EPROM 
programmers.
This device is manufactured using AMD’s 0.32 μm 
process technology, and offers all the features and ben-
efits of the Am29LV200, which was manufactured using 
0.5 μm process technology. In addition, the 
Am29LV200B features unlock bypass programming 
and in-system sector protection/unprotection.
The standard device offers access times of 55, 70, 90 
and 120 ns, allowing high speed microprocessors to 
operate without wait states. To eliminate bus contention 
the device has separate chip enable (CE#), write 
enable (WE#) and output enable (OE#) controls.
The device requires only a 
single 3.0 volt power 
supply
 for both read and write functions. Internally 
generated and regulated voltages are provided for the 
program and erase operations. 
The device is entirely command set compatible with the 
JEDEC single-power-supply Flash standard
. Com-
mands are written to the command register using 
standard microprocessor write timings. Register con-
tents serve as input to an internal state-machine that 
controls the erase and programming circuitry. Write 
cycles also internally latch addresses and data needed 
for the programming and erase operations. Reading 
data out of the device is similar to reading from other 
Flash or EPROM devices.
Device programming occurs by executing the program 
command sequence. This initiates the 
Embedded 
Program
 algorithm—an internal algorithm that auto-
matically times the program pulse widths and verifies 
proper cell margin. The 
Unlock Bypass
 mode facili-
tates faster programming times by requiring only two 
write cycles to program data instead of four.
Device erasure occurs by executing the erase 
command sequence. This initiates the 
Embedded 
Erase
 algorithm—an internal algorithm that automatically 
preprograms the array (if it is not already programmed) 
before executing the erase operation. During erase, the 
device automatically times the erase pulse widths and 
verifies proper cell margin. 
The host system can detect whether a program or 
erase operation is complete by observing the RY/BY# 
pin, or by reading the DQ7 (Data# Polling) and DQ6 
(toggle) 
status bits
.  After a program or erase cycle has 
been completed, the device is ready to read array data 
or accept another command. 
The 
sector erase architecture
 allows memory sectors 
to be erased and reprogrammed without affecting the 
data contents of other sectors. The device is fully 
erased when shipped from the factory.
Hardware data protection
 measures include a low 
V
CC
 detector that automatically inhibits write opera-
tions during power transitions. The 
hardware sector 
protection
 feature disables both program and erase 
operations in any combination of the sectors of 
memory. This can be achieved in-system or via pro-
gramming equipment.
The 
Erase Suspend
 feature enables the user to put 
erase on hold for any period of time to read data from, 
or program data to, any sector that is not selected for 
erasure. True background erase can thus be achieved.
The 
hardware RESET# pin
 terminates any operation 
in progress and resets the internal state machine to 
reading array data. The RESET# pin may be tied to the 
system reset circuitry. A system reset would thus also 
reset the device, enabling the system microprocessor 
to read the boot-up firmware from the Flash memory.
The device offers two power-saving features. When 
addresses have been stable for a specified amount of 
time, the device enters the 
automatic sleep mode
. 
The system can also place the device into the 
standby 
mode
. Power consumption is greatly reduced in both 
these modes.
AMD’s Flash technology combines years of Flash 
memory manufacturing experience to produce the 
highest levels of quality, reliability and cost effective-
ness. The device electrically erases all bits within a 
sector simultaneously via Fowler-Nordheim tunneling. 
The data is programmed using hot electron injection.