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    參數(shù)資料
    型號: AM29LV160MB70RFI
    廠商: ADVANCED MICRO DEVICES INC
    元件分類: PROM
    英文描述: 16 Megabit (2 M x 8-Bit/1 M x 16-Bit) MirrorBit TM 3.0 Volt-only Boot Sector Flash Memory
    中文描述: 1M X 16 FLASH 3V PROM, 70 ns, PDSO48
    封裝: REVERSE, MO-142B, TSOP-48
    文件頁數(shù): 55/63頁
    文件大小: 967K
    代理商: AM29LV160MB70RFI
    January31,2007 25974B5
    Am29LV160M
    53
    D a t a S h e e t
    Erase and Programming Performance
    Notes:
    1.
    Typical program and erase times assume the following conditions: 25
    °
    C, V
    CC
    = 3.0V, 100,000 cycles. Additionally,
    programming typicals assume checkerboard pattern.
    Under worst case conditions of 90°C, V
    CC
    = 2.7 V, 100,000 cycles.
    The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes
    program faster than the maximum program times listed.
    In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
    System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See
    Table 10, on page 31
    and
    Table 11, on page 32
    for further information on command definitions.
    The device has a minimum erase and program cycle endurance of 100,000 cycles.
    2.
    3.
    4.
    5.
    6.
    Latchup Characteristics
    Note:
    Includes all pins except V
    CC
    . Test conditions: V
    CC
    = 3.0 V, one pin at a time.
    TSOP Pin and BGA Package Capacitance
    Notes:
    1.
    2.
    Sampled, not 100% tested.
    Test conditions T
    A
    = 25°C, f = 1.0 MHz.
    Data Retention
    Parameter
    Typ ( Note 1)
    Max ( Note 2)
    Unit
    Comments
    Sector Erase Time
    0.7
    15
    sec
    Excludes 00h programming prior to
    erasure (Note 4)
    Chip Erase Time
    32
    Byte Programming Time
    18
    300
    μs
    Excludes system level overhead
    (Note 5)
    Word Programming Time
    18
    300
    Chip Programming Time
    (Note 3)
    Byte Mode
    36
    100
    sec
    Word Mode
    19
    66
    Description
    Min
    Max
    Input voltage with respect to V
    on all pins except I/O pins
    (including A9, OE#, and RESET#)
    –1.0 V
    12.5 V
    Input voltage with respect to V
    SS
    on all I/O pins
    –1.0 V
    V
    CC
    + 1.0 V
    V
    CC
    Current
    –100 mA
    + 100 mA
    Parameter Symbol
    Parameter Description
    Test Setup
    Typ
    Max
    Unit
    C
    IN
    Input Capacitance
    V
    IN
    = 0
    TSOP
    6
    7.5
    pF
    Fine-pitch BGA
    4.2
    5.0
    pF
    C
    OUT
    Output Capacitance
    V
    OUT
    = 0
    TSOP
    8.5
    12
    pF
    Fine-pitch BGA
    5.4
    6.5
    pF
    C
    IN2
    Control Pin Capacitance
    V
    IN
    = 0
    TSOP
    7.5
    9
    pF
    Fine-pitch BGA
    3.9
    4.7
    pF
    Parameter
    Test Conditions
    Min
    Unit
    Minimum Pattern Data Retention Time
    150
    °
    C
    10
    Years
    125
    °
    C
    20
    Years
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