參數(shù)資料
型號： AM29LV128ML113FI
廠商： ADVANCED MICRO DEVICES INC
元件分類： PROM
英文描述： 128 Megabit (8 M x 16-Bit/16 M x 8-Bit) MirrorBit⑩ 3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O Control
中文描述： 8M X 16 FLASH 3V PROM, 110 ns, PDSO56
封裝： REVERSE, MO-142B, TSOP-56
文件頁數(shù)： 5/65頁
文件大?。?/td> 1222K
代理商： AM29LV128ML113FI
September 9, 2003
Am29LV128MH/L
3
D A T A S H E E T
TABLE OF CONTENTS
Product Selector Guide. . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5
Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . 8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 9
Table 1. Device Bus Operations ....................................................... 9
Word/Byte Configuration ..........................................................9
VersatileIO
(V
IO
) Control .......................................................9
Requirements for Reading Array Data ...................................10
Page Mode Read ............................................................................10
Writing Commands/Command Sequences ............................10
Write Buffer .....................................................................................10
Accelerated Program Operation ......................................................10
Autoselect Functions .......................................................................10
Standby Mode ........................................................................10
Automatic Sleep Mode ...........................................................11
RESET#: Hardware Reset Pin ...............................................11
Output Disable Mode ..............................................................11
Table 2. Sector Address Table........................................................ 12
Autoselect Mode .....................................................................18
Table 3. Autoselect Codes, (High Voltage Method) ....................... 18
Sector Group Protection and Unprotection .............................19
Table 4. Sector Group Protection/Unprotection Address Table ..... 19
Write Protect (WP#) ................................................................20
Temporary Sector Group Unprotect .......................................20
Figure 1. Temporary Sector Group Unprotect Operation ................20
Figure 2. In-System Sector Group Protect/Unprotect Algorithms ...21
SecSi (Secured Silicon) Sector Flash Memory Region ..........22
Table 5. SecSi Sector Contents...................................................... 22
Figure 3. SecSi Sector Protect Verify ..............................................23
Hardware Data Protection ......................................................23
Low VCC Write Inhibit .....................................................................23
Write Pulse “Glitch” Protection ........................................................23
Logical Inhibit ..................................................................................23
Power-Up Write Inhibit ....................................................................23
Common Flash Memory Interface (CFI). . . . . . . 23
Table 6. CFI Query Identification String ..........................................24
Table 7. System Interface String..................................................... 24
Table 8. Device Geometry Definition ..............................................25
Table 9. Primary Vendor-Specific Extended Query ........................26
Command Definitions . . . . . . . . . . . . . . . . . . . . . 27
Reading Array Data ................................................................27
Reset Command .....................................................................27
Autoselect Command Sequence ............................................27
Enter SecSi Sector/Exit SecSi Sector Command Sequence ..28
Word/Byte Program Command Sequence .............................28
Unlock Bypass Command Sequence ..............................................28
Write Buffer Programming ...............................................................28
Accelerated Program ......................................................................29
Figure 4. Write Buffer Programming Operation ...............................30
Figure 5. Program Operation ..........................................................31
Program Suspend/Program Resume Command Sequence ...31
Figure 6. Program Suspend/Program Resume ...............................32
Chip Erase Command Sequence ...........................................32
Sector Erase Command Sequence ........................................32
Figure 7. Erase Operation ...............................................................33
Erase Suspend/Erase Resume Commands ...........................33
Command Definitions .............................................................34
Table 10. Command Definitions (x16 Mode, BYTE# = V
IH
)........... 34
Table 11. Command Definitions (x8 Mode, BYTE# = V
).............. 35
Write Operation Status. . . . . . . . . . . . . . . . . . . . . 36
DQ7: Data# Polling .................................................................36
Figure 8. Data# Polling Algorithm .................................................. 36
RY/BY#: Ready/Busy# ............................................................37
DQ6: Toggle Bit I ....................................................................37
Figure 9. Toggle Bit Algorithm ........................................................ 38
DQ2: Toggle Bit II ...................................................................38
Reading Toggle Bits DQ6/DQ2 ...............................................38
DQ5: Exceeded Timing Limits ................................................39
DQ3: Sector Erase Timer .......................................................39
DQ1: Write-to-Buffer Abort .....................................................39
Table 12. Write Operation Status................................................... 40
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 41
Figure 10. Maximum Negative Overshoot Waveform ................... 41
Figure 11. Maximum Positive Overshoot Waveform ..................... 41
Operating Ranges. . . . . . . . . . . . . . . . . . . . . . . . . 41
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 42
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 12. Test Setup .................................................................... 43
Table 13. Test Specifications......................................................... 43
Key to Switching Waveforms. . . . . . . . . . . . . . . . 43
Figure 13. Input Waveforms and Measurement Levels ................. 43
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 44
Read-Only Operations ...........................................................44
Figure 14. Read Operation Timings ............................................... 44
Figure 15. Page Read Timings ...................................................... 45
Hardware Reset (RESET#) ....................................................46
Figure 16. Reset Timings ............................................................... 46
Erase and Program Operations ..............................................47
Figure 17. Reset Timings ............................................................... 48
Figure 18. Program Operation Timings .......................................... 49
Figure 19. Accelerated Program Timing Diagram .......................... 49
Figure 20. Chip/Sector Erase Operation Timings .......................... 50
Figure 21. Data# Polling Timings (During Embedded Algorithms) . 51
Figure 22. Toggle Bit Timings (During Embedded Algorithms) ...... 52
Figure 23. DQ2 vs. DQ6 ................................................................. 52
Temporary Sector Group Unprotect .......................................53
Figure 24. Temporary Sector Group Unprotect Timing Diagram ... 53
Figure 25. Sector Group Protect and Unprotect Timing Diagram .. 54
Alternate CE# Controlled Erase and Program Operations .....55
Figure 26. Alternate CE# Controlled Write (Erase/Program)
Operation Timings .......................................................................... 56
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 56
Erase And Programming Performance. . . . . . . . 57
TSOP Pin and BGA Package Capacitance . . . . . 58
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 59
TS056/TSR056—56-Pin Standard/Reverse Thin Small Outline
Package (TSOP) .....................................................................59
LAA064—64-Ball Fortified Ball Grid Array
13 x 11 mm Package ..............................................................60
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 61
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