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參數(shù)資料
| 型號(hào)： | AM29F800BB-90DGC1 |
| 廠商： | ADVANCED MICRO DEVICES INC |
| 元件分類： | PROM |
| 英文描述： | 8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory-Die Revision 1 |
| 中文描述： | 1M X 8 FLASH 5V PROM, 90 ns, UUC44 |
| 文件頁(yè)數(shù)： | 7/9頁(yè) |
| 文件大小： | 207K |
| 代理商： | AM29F800BB-90DGC1 |
5/4/98
Am29F800B Known Good Die
7
SU PP L E ME NT
PHYSICAL SPECIFICATIONS
Die dimensions . . . . . . . . . 141.34 mils x 306.30 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . . 3.59 mm x 7.78 mm
Die Thickness. . . . . . . . . . . . . . . . . . . . . . . . . ~20 mils
Bond Pad Size . . . . . . . . . . . . . . 3.94 mils x 3.94 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 m x 100 m
Pad Area Free of Passivation . . . . . . . . . .15.52 mils2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10,000 m2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Cu/Si
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded (optional)
Passivation . . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
DC OPERATING CONDITIONS
VCC (Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V
Junction Temperature Under Bias . .TJ (max) = 130°C
Operating Temperature
Commercial . . . . . . . . . . . . . . . . . . . 0
°C to +70°C
Industrial . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Extended . . . . . . . . . . . . . . . . . . –55
°C to +125°C
MANUFACTURING INFORMATION
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL
Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SDC
Manufacturing ID (Top Boot) . . . . . . . . . . . . 98924AK
(Bottom Boot) . . . . . . . .98924ABK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . . . . CS39
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HANDLING INSTRUCTIONS
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250
°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30
°C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM29F800BB-90EC | 制造商:Spansion 功能描述:8M CMOS FLASH 5V |
| AM29F800BB-90EC\T | 制造商:Spansion 功能描述:Flash Mem Parallel 5V 8M-Bit 1M x 8/512K x 16 90ns 48-Pin TSOP T/R |
| AM29F800BB-90ED | 制造商:Spansion 功能描述:FLASH BOTTOM BLOCK 8MB SMD 29F800 |
| AM29F800BB-90EI\T | 制造商:Spansion 功能描述:NOR Flash Parallel 5V 8Mbit 1M/512K x 8bit/16bit 90ns 48-Pin TSOP T/R |
| AM29F800BB-90SD | 制造商:Spansion 功能描述:FLASH BOTTOM BLOCK 8MB SMD 29F800 |
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