參數(shù)資料
型號: Am29F400BB-120DTC
廠商: Advanced Micro Devices, Inc.
英文描述: 4 Megabit (512 K x 8-Bit/256 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory-Die Revision 1
中文描述: 4兆位(512畝x 8-Bit/256畝x 16位),5.0伏的CMOS只,引導(dǎo)扇區(qū)快閃記憶體模修訂1
文件頁數(shù): 7/9頁
文件大?。?/td> 139K
代理商: AM29F400BB-120DTC
Am29F400B Known Good Die
7
S U P P L E M E N T
PHYSICAL SPECIFICATIONS
Die dimensions . . . . . . . . . 141.34 mils x 207.48 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . .3.59 mm x 5.27 mm
Die Thickness. . . . . . . . . . . . . . . . . . . . . . . . . ~20 mils
Bond Pad Size . . . . . . . . . . . . . . 3.94 mils x 3.94 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
100 μm x 100 μm
Pad Area Free of Passivation . . . . . . . . . .15.52 mils
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10,000 μm
2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Cu/Si
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded (optional)
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
DC OPERATING CONDITIONS
V
CC
(Supply Voltage) . . . . . . . . . . . . . . .4.5 V to 5.5 V
Junction Temperature Under Bias . .T
J
(max) = 130
°
C
Operating Temperature
Commercial . . . . . . . . . . . . . . . . . . . 0
°
C to +70
°
C
Industrial . . . . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Extended . . . . . . . . . . . . . . . . . . –55
°
C to +125
°
C
MANUFACTURING INFORMATION
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . .FASL
Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SDC
Manufacturing ID (Top Boot) . . . . . . . . . . . .98965AK
(Bottom Boot) . . . . . . . .98965ABK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . . . .CS39
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HANDLING INSTRUCTIONS
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250
°
C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30
°
C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
相關(guān)PDF資料
PDF描述
Am29F400BB-120DGC Displays; Color:Yellow/Green; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Lens Color:White; Luminous Intensity (MSCP):6/14ucd RoHS Compliant: Yes
AM29F400BB-120DGC1 LED Lamp; Bulb Size:5mm; LED Color:Red/Green; Luminous Intensity:2.7ucd; Viewing Angle:120 ; Forward Current:10mA; Forward Voltage:2.1V; Operating Temperature Range:-25 C to +85 C; Color:Red/Green; Leaded Process Compatible:Yes RoHS Compliant: Yes
Am29F400BB-120DGE LED Lamp; Bulb Size:T-1; LED Color:Blue; Luminous Intensity:250ucd; Viewing Angle:40 ; Forward Current:20mA; Forward Voltage:3.8V; Operating Temperature Range:-40 C to +85 C; Color:Blue; Leaded Process Compatible:Yes RoHS Compliant: Yes
AM29F400BB-120DGE1 LED Lamp; Bulb Size:T-1; LED Color:White; Luminous Intensity:750ucd; Viewing Angle:35 ; Forward Current:20mA; Forward Voltage:3.5V; Operating Temperature Range:-40 C to C; Color:White; Leaded Process Compatible:Yes RoHS Compliant: Yes
Am29F400BB-120DGI LED Lamp; LED Color:Blue; Luminous Intensity:29mcd; Viewing Angle:120 ; Forward Current:20mA; Forward Voltage:3.8V; Operating Temperature Range:-30 C to +85 C; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes
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