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參數(shù)資料
| 型號： | AM29F400AB-65EI |
| 廠商： | ADVANCED MICRO DEVICES INC |
| 元件分類： | PROM |
| 英文描述： | Dual Retriggerable Monostable Multivibrators 16-SO -40 to 85 |
| 中文描述： | 512K X 8 FLASH 5V PROM, 60 ns, PDSO48 |
| 封裝： | TSOP-48 |
| 文件頁數(shù)： | 7/9頁 |
| 文件大?。?/td> | 139K |
| 代理商： | AM29F400AB-65EI |
Am29F400B Known Good Die
7
S U P P L E M E N T
PHYSICAL SPECIFICATIONS
Die dimensions . . . . . . . . . 141.34 mils x 207.48 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . .3.59 mm x 5.27 mm
Die Thickness. . . . . . . . . . . . . . . . . . . . . . . . . ~20 mils
Bond Pad Size . . . . . . . . . . . . . . 3.94 mils x 3.94 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
100 μm x 100 μm
Pad Area Free of Passivation . . . . . . . . . .15.52 mils
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10,000 μm
2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Cu/Si
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded (optional)
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
DC OPERATING CONDITIONS
V
CC
(Supply Voltage) . . . . . . . . . . . . . . .4.5 V to 5.5 V
Junction Temperature Under Bias . .T
J
(max) = 130
°
C
Operating Temperature
Commercial . . . . . . . . . . . . . . . . . . . 0
°
C to +70
°
C
Industrial . . . . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Extended . . . . . . . . . . . . . . . . . . –55
°
C to +125
°
C
MANUFACTURING INFORMATION
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . .FASL
Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SDC
Manufacturing ID (Top Boot) . . . . . . . . . . . .98965AK
(Bottom Boot) . . . . . . . .98965ABK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . . . .CS39
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HANDLING INSTRUCTIONS
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250
°
C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30
°
C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
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| AM29F400AB-65FC | 4 Megabit (524,288 x 8-Bit/262,144 x 16-Bit) CMOS 5.0 Volt-only, Sector Erase Flash Memory |
| Am29F400BB-120DTC | 4 Megabit (512 K x 8-Bit/256 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory-Die Revision 1 |
| Am29F400BB-120DGC | Displays; Color:Yellow/Green; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes; Lens Color:White; Luminous Intensity (MSCP):6/14ucd RoHS Compliant: Yes |
| AM29F400BB-120DGC1 | LED Lamp; Bulb Size:5mm; LED Color:Red/Green; Luminous Intensity:2.7ucd; Viewing Angle:120 ; Forward Current:10mA; Forward Voltage:2.1V; Operating Temperature Range:-25 C to +85 C; Color:Red/Green; Leaded Process Compatible:Yes RoHS Compliant: Yes |
| Am29F400BB-120DGE | LED Lamp; Bulb Size:T-1; LED Color:Blue; Luminous Intensity:250ucd; Viewing Angle:40 ; Forward Current:20mA; Forward Voltage:3.8V; Operating Temperature Range:-40 C to +85 C; Color:Blue; Leaded Process Compatible:Yes RoHS Compliant: Yes |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM29F400AB-70EI | 制造商:Advanced Micro Devices 功能描述: |
| AM29F400AB-75EC | 制造商:Advanced Micro Devices 功能描述: |
| AM29F400AB90SC | 制造商:AMD 功能描述:* |
| AM29F400AT-120SC | 制造商:Advanced Micro Devices 功能描述:Flash Mem Parallel 5V 4M-Bit 512K x 8/256K x 16 120ns 44-Pin SO |
| AM29F400AT-90SC | 制造商:Advanced Micro Devices 功能描述:NOR Flash, 256K x 16, 44 Pin, Plastic, SOP |
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