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參數(shù)資料
| 型號(hào)： | AM29F200BB-75DPC1 |
| 廠(chǎng)商： | ADVANCED MICRO DEVICES INC |
| 元件分類(lèi)： | PROM |
| 英文描述： | 128K X 16 FLASH 5V PROM, 70 ns, UUC42 |
| 封裝： | DIE-42 |
| 文件頁(yè)數(shù)： | 9/10頁(yè) |
| 文件大?。?/td> | 174K |
| 代理商： | AM29F200BB-75DPC1 |
8
Am29F200B Known Good Die
SU PP L E ME NT
PHYSICAL SPECIFICATIONS
Die dimensions . . . . . . . . . . . . . . 135 mils x 150 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . . 3.43 mm x 3.81 mm
Die Thickness. . . . . . . . . . . . . . . . . . . . . . . . 19.7 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500 m
Bond Pad Size . . . . . . . . . . . . . . 4.69 mils x 4.69 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . 115.9 m x 115.9 m
Pad Area Free of Passivation . . . . . . . . . .13.99 mils2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9,025 m2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded (optional)
Passivation . . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
DC OPERATING CONDITIONS
VCC (Supply Voltage) . . . . . . . . . . . . . . . 4.5 V to 5.5 V
Junction Temperature Under Bias:
Commerical, Industrial, and
Extended Temperature Range . . . . .TJ (max) = 130°C
Operating Temperature
Commercial . . . . . . . . . . . . . . . . . . . 0
°C to +70°C
Industrial . . . . . . . . . . . . . . . . . . . –40
°C to +85°C
Extended . . . . . . . . . . . . . . . . . . –55
°C to +125°C
Contact AMD for higher temperature range devices.
MANUFACTURING INFORMATION
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . FASL
Wafer Sort Test . . . . . . . . . . . . . Sunnyvale, CA, USA,
. . . . . . . . . . . . . . . . . . . . . . . . .and Penang, Malaysia
Manufacturing ID (Top Boot) . . . . . . . . . . . . 98480AK
(Bottom Boot) . . . . . . . .98480ABK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . . CS39S
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HANDLING INSTRUCTIONS
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250
°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30
°C in a nitrogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM29F200T-90FD | 256K X 8 FLASH 5V PROM, 90 ns, PDSO48 |
| AM29F200T-150FE | 256K X 8 FLASH 5V PROM, 150 ns, PDSO48 |
| AM29F200B-150FC | 256K X 8 FLASH 5V PROM, 150 ns, PDSO48 |
| AM29F400BB-120ED | Flash Memory IC; Leaded Process Compatible:Yes; Memory Size:4Mbit; Package/Case:48-TSOP; Peak Reflow Compatible (260 C):Yes; Supply Voltage Max:5V; Access Time, Tacc:120ns; Series:AM29 RoHS Compliant: Yes |
| AM29F400BB-120EF | Flash Memory IC; Leaded Process Compatible:Yes; Memory Size:4Mbit; Package/Case:48-TSOP; Peak Reflow Compatible (260 C):Yes; Supply Voltage Max:5V; Access Time, Tacc:120ns; Series:AM29 RoHS Compliant: Yes |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM29F200BB-90EC | 制造商:Advanced Micro Devices 功能描述: |
| AM29F200BB-90EF | 制造商:Advanced Micro Devices 功能描述: |
| AM29F200BB-90EI | 制造商:Spansion 功能描述:2M CMOS FLASH 5V 制造商:Advanced Micro Devices 功能描述: |
| AM29F200BB-90SE | 制造商:Spansion 功能描述:NOR Flash Parallel 5V 2Mbit 256K/128K x 8bit/16bit 90ns 44-Pin SOIC |
| AM29F200BT-120EI | 制造商:Advanced Micro Devices 功能描述:256K X 8 FLASH 5V PROM, 120 ns, PDSO48 |
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