參數(shù)資料
型號: AM29F032B-120EI
廠商: ADVANCED MICRO DEVICES INC
元件分類: PROM
英文描述: 32 Megabit (4 M x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory
中文描述: 4M X 8 FLASH 5V PROM, 120 ns, PDSO40
封裝: MO-142CD, TSOP-40
文件頁數(shù): 4/39頁
文件大小: 937K
代理商: AM29F032B-120EI
Am29F032B
3
TABLE OF CONTENTS
Product Selector Guide. . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5
Pin Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . 7
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 8
Table 1. Am29F032B Device Bus Operations .................................. 8
Requirements for Reading Array Data ..................................... 8
Writing Commands/Command Sequences .............................. 8
Program and Erase Operation Status ...................................... 9
Standby Mode .......................................................................... 9
RESET#: Hardware Reset Pin ................................................. 9
Output Disable Mode................................................................ 9
Table 2. Am29F032B Sector Address Table................................... 10
Autoselect Mode..................................................................... 11
Table 3. Am29F032B Autoselect Codes......................................... 11
Sector Group Protection/Unprotection.................................... 12
Table 4. Sector Group Addresses................................................... 12
Temporary Sector Group Unprotect ....................................... 12
Figure 1. Temporary Sector Group Unprotect Operation................ 12
Hardware Data Protection...................................................... 13
Low VCC Write Inhibit..................................................................... 13
Write Pulse “Glitch” Protection........................................................ 13
Logical Inhibit.................................................................................. 13
Power-Up Write Inhibit.................................................................... 13
Command Definitions . . . . . . . . . . . . . . . . . . . . . 13
Reading Array Data................................................................ 13
Reset Command..................................................................... 13
Autoselect Command Sequence............................................ 14
Byte Program Command Sequence....................................... 14
Chip Erase Command Sequence........................................... 14
Figure 2. Program Operation .......................................................... 15
Sector Erase Command Sequence........................................ 15
Erase Suspend/Erase Resume Commands........................... 15
Figure 3. Erase Operation............................................................... 16
Command Definitions............................................................. 17
Table 5. Am29F032B Command Definitions................................... 17
Write Operation Status . . . . . . . . . . . . . . . . . . . . 18
DQ7: Data# Polling................................................................. 18
Figure 4. Data# Polling Algorithm ................................................... 18
RY/BY#: Ready/Busy# ........................................................... 19
DQ6: Toggle Bit I.................................................................... 19
DQ2: Toggle Bit II................................................................... 19
Reading Toggle Bits DQ6/DQ2 .............................................. 19
DQ5: Exceeded Timing Limits................................................ 20
DQ3: Sector Erase Timer ....................................................... 20
Figure 5. Toggle Bit Algorithm........................................................ 20
Table 6. Write Operation Status..................................................... 21
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 22
Figure 6. Maximum Negative Overshoot Waveform...................... 22
Figure 7. Maximum Positive Overshoot Waveform........................ 22
Operating Ranges. . . . . . . . . . . . . . . . . . . . . . . . . 22
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 23
TTL/NMOS Compatible .......................................................... 23
CMOS Compatible.................................................................. 23
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 8. Test Setup...................................................................... 24
Table 7. Test Specifications........................................................... 24
Key To Switching Waveforms . . . . . . . . . . . . . . . 24
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25
Read-only Operations............................................................. 25
Figure 9. Read Operation Timings................................................. 25
Hardware Reset (RESET#) .................................................... 26
Figure 10. RESET# Timings .......................................................... 26
Write (Erase/Program) Operations......................................... 27
Figure 11. Program Operation Timings.......................................... 28
Figure 12. Chip/Sector Erase Operation Timings .......................... 29
Figure 13. Data# Polling Timings (During Embedded Algorithms). 30
Figure 14. Toggle Bit Timings (During Embedded Algorithms)...... 30
Figure 15. DQ2 vs. DQ6................................................................. 31
Temporary Sector Unprotect .................................................. 31
Figure 16. Temporary Sector Group Unprotect Timings................ 31
Write (Erase/Program) Operations—Alternate CE#
Controlled Writes.................................................................... 32
Figure 17. Alternate CE# Controlled Write Operation Timings ...... 33
Erase And Programming Performance . . . . . . . 34
Latchup Characteristic . . . . . . . . . . . . . . . . . . . . 34
TSOP And SO Pin Capacitance . . . . . . . . . . . . . 34
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 35
SO 044–44-Pin Small Outline Package.................................. 35
TS 040–40-Pin Standard Thin Small Outline Package........... 36
TSR040–40-Pin Reversed Thin Small Outline Package ........ 37
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 38
Revision A (June 1998) .......................................................... 38
Revision B (July 1998)............................................................ 38
Revision C (January 1999)..................................................... 38
Revision C+1 (April 14, 1999)................................................. 38
Revision D (November 17, 1999) ........................................... 38
Revision D+1 (December 5, 2000)......................................... 38
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