參數(shù)資料
型號(hào)： AM29F004BB-70JI
英文描述： x8 Flash EEPROM
中文描述： x8閃存EEPROM的
文件頁(yè)數(shù)： 6/39頁(yè)
文件大?。?/td> 728K
代理商： AM29F004BB-70JI
6
Am29F002B/Am29F002NB
PIN CONFIGURATION
A0–A17
=
18 addresses
DQ0–DQ7 =
8 data inputs/outputs
CE#
=
Chip enable
OE#
= Output enable
WE#
=
Write enable
RESET#
=
Hardware reset pin, active low
(not available on Am29F002NB)
V
CC
=
+5.0 V single power supply
(see Product Selector Guide for
device speed ratings and voltage
supply tolerances)
V
SS
NC
=
Device ground
=
Pin not connected internally
LOGIC SYMBOL
18
8
DQ0–DQ7
A0–A17
CE#
OE#
WE#
RESET#
N/C on Am29F002NB
相關(guān)PDF資料
PDF描述
AM29F004BB-90JE -100V Single P-Channel HEXFET Power MOSFET in a TO-262 package; A IRF9540NL with Standard Packaging
AM29F010-55PC5 -55V Single P-Channel HEXFET Power MOSFET in a TO-220AB package; Similar to the IRF9Z24N with Lead-Free Packaging.
AM29F010-55PE5 x8 Flash EEPROM
AM29F010-55PI5 -150V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF6216 with Lead Free Packaging
AM29F100AT-90FE 55V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRFZ24NL with Lead Free Packaging
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM29F010 制造商:Panasonic Industrial Company 功能描述:IC
AM29F010-120DGC1 制造商:Spansion 功能描述:1M FLASH KNOWN GOOD DIE (COMMERCIAL TEMP) - Gel-pak, waffle pack, wafer, diced wafer on film
AM29F010-120DGE1 制造商:Spansion 功能描述:1M FLASH KNOWN GOOD DIE (EXTEND TEMP) - Gel-pak, waffle pack, wafer, diced wafer on film
AM29F010-120DGI1 制造商:Spansion 功能描述:1M FLASH KNOWN GOOD DIE (INDUSTRIAL TEMP) - Gel-pak, waffle pack, wafer, diced wafer on film
AM29F010-120JC 制造商:Advanced Micro Devices 功能描述: 制造商:Advanced Micro Devices 功能描述:NOR Flash, 128K x 8, 32 Pin, Plastic, PLCC 制造商:Analog Devices 功能描述:NOR Flash, 128K x 8, 32 Pin, Plastic, PLCC
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