參數(shù)資料
型號(hào)： AM29BL162CB-35DTI1
廠商： Spansion Inc.
英文描述： 16 Megabit (1 M x 16-Bit) CMOS 3.0 Volt-only, Burst-Mode, Boot Sector Flash Memory-Die Revision 1
中文描述： 16兆位（1米× 16位），3.0伏的CMOS只，突發(fā)性，引導(dǎo)扇區(qū)閃存模式模修訂1
文件頁(yè)數(shù)： 15/19頁(yè)
文件大?。?/td> 151K
代理商： AM29BL162CB-35DTI1
14
Am29BL162C Known Good Die
S U P P L E M E N T
PRODUCT TEST FLOW
Figure 1 provides an overview of AMD’s Known Good
Die test flow. For more detailed information, refer to the
Am29BL162C product qualification database. AMD
implements quality assurance procedures throughout
the product test flow. These QA procedures also allow
AMD to produce KGD products without requiring or
implementing burn-in. In addition, an off-line qualifica-
tion maintenance program (QMP) guarantees AMD
standards are met on KGD products.
Figure 1.
AMD KGD Product Test Flow
Wafer Sort 1
Bake
24 hours at 250
°
C
Wafer Sort 2
Wafer Sort 3
High Temperature
Packaging for Shipment
Shipment
DC Parameters
Functionality
Programmability
Erasability
Data Retention
DC Parameters
Functionality
Programmability
Erasability
DC Parameters
Functionality
Programmability
Erasability
Speed
Incoming Inspection
Wafer Saw
Die Separation
100% Visual Inspection
Die Pack
相關(guān)PDF資料
PDF描述
AM29BL162CB-35DWE1 16 Megabit (1 M x 16-Bit) CMOS 3.0 Volt-only, Burst-Mode, Boot Sector Flash Memory-Die Revision 1
AM29BL162CB-35DWH1 16 Megabit (1 M x 16-Bit) CMOS 3.0 Volt-only, Burst-Mode, Boot Sector Flash Memory-Die Revision 1
AM29BL162CB-35DWI1 16 Megabit (1 M x 16-Bit) CMOS 3.0 Volt-only, Burst-Mode, Boot Sector Flash Memory-Die Revision 1
AM29BL162CB-3DGE1 16 Megabit (1 M x 16-Bit) CMOS 3.0 Volt-only, Burst-Mode, Boot Sector Flash Memory-Die Revision 1
AM29BL162CB-3DGH1 16 Megabit (1 M x 16-Bit) CMOS 3.0 Volt-only, Burst-Mode, Boot Sector Flash Memory-Die Revision 1
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