
October 1, 2003 27243B1
Am29BDS320G
9
P r e l i m i n a r y
Connection Diagram
Special Handling Instructions for FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultra-
sonic cleaning methods. The package and/or data integrity may be compromised
if the package body is exposed to temperatures above 150°C for prolonged peri-
ods of time.
A2
B2
C2
D2
E2
F2
G2
H2
A3
B3
C3
D3
E3
F3
G3
H3
A4
B4
C4
D4
E4
F4
G4
H4
A5
B5
C5
D5
E5
F5
G5
H5
A6
B6
C6
D6
E6
F6
G6
H6
A7
B7
C7
D7
E7
F7
G7
H7
DQ15
V
SS
NC
A16
A15
A14
A12
A13
A8
B8
C8
D8
E8
F8
G8
H8
NC
NC
NC
V
SS
V
IO
NC
NC
NC
DQ13
DQ6
DQ14
DQ7
A11
A10
A8
A9
V
CC
DQ4
DQ12
DQ5
A19
NC
RESET#
WE#
DQ11
DQ3
DQ10
DQ2
A20
A18
ACC
RDY
DQ9
DQ1
DQ8
DQ0
A5
A6
A17
A7
OE#
V
SS
CE#
A0
A2
A4
A3
A1
B1
C1
D1
E1
F1
G1
H1
V
SS
NC
V
IO
AVD#
WP#
CLK
V
CC
NC
64-ball Fine-Pitch Ball Grid Array
(Top View, Balls Facing Down)