參數(shù)資料
型號: AH22
元件分類: 放大器
英文描述: 50 MHz - 1000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封裝: SOIC-8
文件頁數(shù): 5/5頁
文件大?。?/td> 255K
代理商: AH22
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 5 of 5 February 2005
The Communications Edge
TM
AH22
High Dynamic Range CATV Amplifier
Product Information
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
° C
Thermal Resistance
1, Rth
28
° C/W
Junction Temperature
2, Tjc
127
°
Notes:
1. The thermal resistance is referenced from the hottest part
of the junction to ground tab underneath the device.
2. This corresponds to the typical biasing condition of
+5V, 300 mA at an 85
° C case
temperature.
A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160
° C.
Product Marking
The component will be marked with an
“AH22” designator with an alphanumeric lot
code on the top surface of the package. Tape
and reel specifications for this part are located
on the website in the “Application Notes”
section.
ESD / MSL Information
ESD Rating:
Class 1B
Value:
Passes from 500 to 1000 V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating:
Class IV
Value
Passes greater than 1000 V
Test:
Charge Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 1 at +235
° C convection reflow
Standard:
JEDEC Standard J-STD-020A
Functional Pin Layout
Pin
Function
1
RF input (Amp1 input)
2
Ground
3
Ground
4
RF input (Amp2 input)
5
RF output (Amp2 output)
6
Ground
7
Ground
8
RF output (Amp1 output)
The backside paddle is the Source and should be
grounded for thermal and electrical purposes.
Mounting Config. Notes
1.
Ground / thermal vias are critical for the proper performance
of this device.
2.
Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3.
To ensure reliable operation, device ground paddle-to-ground
pad solder joint is critical.
4.
Add mounting screws near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts
the heatsink.
5.
For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
6.
RF trace width depends upon the PC board material and
construction.
7.
Use 1 oz. Copper minimum.
8.
If the PCB design rules allow, ground vias should be placed
under the land pattern for better RF and thermal performance.
Otherwise ground vias should be placed as close to the land
pattern as possible.
9.
A minimum of 12 ground vias are required for .014” and .028”
FR4 board.
MTTF vs. GNDTab Temperature
1
10
100
1000
60
70
80
90
100
110
Tab Temperature (°C)
MTTF
(million
hrs
)
相關(guān)PDF資料
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AH266-PL-A MAGNETIC FIELD SENSOR-HALL EFFECT, -7-7mT, 1.10-1.50V, RECTANGULAR, THROUGH HOLE MOUNT
AH266-PL-B MAGNETIC FIELD SENSOR-HALL EFFECT, -10-10mT, 1.10-1.50V, RECTANGULAR, THROUGH HOLE MOUNT
AH266-PLA-A MAGNETIC FIELD SENSOR-HALL EFFECT, -7-7mT, 1.10-1.50V, RECTANGULAR, THROUGH HOLE MOUNT
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