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參數(shù)資料
| 型號(hào)： | AH212-S8G |
| 元件分類： | 放大器 |
| 英文描述： | 1800 MHz - 2400 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | GREEN, MS-012, SMT, SOIC-8 |
| 文件頁(yè)數(shù)： | 4/12頁(yè) |
| 文件大小： | 512K |
| 代理商： | AH212-S8G |
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com, www.TriQuint.com
Page 12 of 12 March 2008
AH212
1 Watt High Linearity, High Gain InGaP HBT Amplifier
AH212-EG (Lead-Free DFN 4x5 mm Package) Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is Matte Tin. It is compatible with both lead-free
(maximum 260
°C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
AH212-EG
Mounting Configuration / Land Pattern
Product Marking
The component will be marked with an
“AH212-EG” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Passes
500V to <1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes ≥ 2000V min.
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 2 at +260
°C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted device
is recommended for proper thermal operation. Damage to the
device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
3. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
5. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters
Functional Pin Layout
Function
Pin No.
Vcc1
12
Input
3
Output /Vcc2
9, 10
Vbias1
1
Vbias2
6
GND
Backside Paddle
N/C or GND
2, 4, 5, 7, 8, 11
Vbias1 1
2
3
4
5
6
12
11
10
9
8
7
N/C
RF In
N/C
Vbias2
Vcc1
N/C
Vcc2 / RF Out
N/C
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|---|---|
| AH212-EG | 1800 MHz - 2400 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AH212-S8PCB1960 | 功能描述:射頻開發(fā)工具 1960MHz Eval Brd 26dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評(píng)估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AH212-S8PCB2140 | 功能描述:射頻開發(fā)工具 2140MHz Eval Brd 25dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評(píng)估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AH212-S8TRG | 制造商:TriQuint Semiconductor 功能描述:RF & MW DRIVER AMPLIFIER |
| AH21420 | 制造商:Cooper Wiring Devices 功能描述: |
| AH215 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:1 Watt, High Linearity HBT Amplifier |
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