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參數(shù)資料
| 型號： | AH212-EG |
| 英文描述： | 1 Watt High Linearity, High Gain InGaP HBT Amplifier |
| 中文描述： | 1瓦特高線性，高增益的InGaP HBT功率放大器 |
| 文件頁數(shù)： | 4/12頁 |
| 文件大小： | 591K |
| 代理商： | AH212-EG |
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 12 of 12 August 2006
AH212
1 Watt High Linearity, High Gain InGaP HBT Amplifier
Product Information
The Communications Edge
TM
AH212-EG (Lead-Free DFN 4x5 mm Package) Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is Matte Tin. It is compatible with both lead-free
(maximum 260
C reflow temperature) and lead (maximum 245
C reflow temperature) soldering processes.
Outline Drawing
AH212-EG
Mounting Configuration / Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
C
Thermal Resistance, Rth
(1)
33
C / W
Junction Temperature, Tj
(2)
156
C
Notes:
1. The thermal resistance is referenced from the junction-to-case at a case.
temperature of 85
C. Tj is a function of the voltage and the current applied. It can
be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V, 400 mA at an 85
C
case temperature.
Product Marking
The component will be marked with an
“
A
H
2
1
2
-EG
”
d
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a
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r
w
i
t
h
a
n
a
l
p
h
a
n
u
m
e
r
i
c
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the
“
A
p
l
i
c
a
t
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o
n
Notes
”
s
e
c
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.
ESD / MSL Information
ESD Rating:
Class 1B
Value:
Passes 500V to <1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating:
Class IV
Value:
Passes
≥
2
0
V
m
i
n
.
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 2 at +260
C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted device
is recommended for proper thermal operation.
Damage to the
device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135
”
)
d
i
a
m
e
t
e
r
d
r
i
l
a
n
d
have a final plated thru diameter of .25 mm (.010
”
)
.
3. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
5. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters
Functional Pin Layout
Function
Pin No.
Vcc1
12
Input
3
Output /Vcc2
9, 10
Vbias1
1
Vbias2
6
GND
Backside Paddle
N/C or GND
2, 4, 5, 7, 8, 11
V
b
i
a
s
1
2
3
4
5
6
1
2
1
0
9
8
7
N
/
C
R
F
I
n
N
/
C
N
/
C
V
b
i
a
s
2
V
c
1
N
/
C
V
c
2
/
R
F
O
u
t
V
c
2
/
R
F
O
u
t
N
/
C
N
/
C
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| AH212-EGPCB1960 | 功能描述:射頻開發(fā)工具 1960MHz Eval Brd 27dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AH212-EGPCB2140 | 功能描述:射頻開發(fā)工具 2140MHz Eval Brd 25.5dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AH212-EGTR | 制造商:TriQuint Semiconductor 功能描述:RF & MW DRIVER AMPLIFIER |
| AH212-EPCB1960 | 功能描述:射頻開發(fā)工具 1800-2400MHz RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AH212-EPCB2140 | 功能描述:射頻開發(fā)工具 1800-2200MHz RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
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