參數(shù)資料
型號: AH118-89G
廠商: TRIQUINT SEMICONDUCTOR INC
元件分類: 放大器
英文描述: 60 MHz - 3500 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封裝: GREEN, SOT-89, TO-243C, 3 PIN
文件頁數(shù): 5/14頁
文件大?。?/td> 572K
代理商: AH118-89G
AH118
Watt, High Linearity InGaP HBT Amplifier
Mechanical Information
Package Information and Dimensions
This package is lead-free/Green/RoHS-
compliant.
It is compatible with both
lead-free (maximum 260
°C reflow
temperature) and leaded (maximum 245
°C
reflow
temperature)
soldering
processes. The plating material on the
leads is NiPdAu.
The AH118 will be marked with an
“AH118G” designator with a lot code
marked below the part designator. The
“Y” represents the last digit of the year
the part was manufactured, the “XXX” is
an auto-generated number, and “Z” refers
to a wafer number in a lot batch
AH118G
YXXX-Z
Mounting Configuration
All dimensions are in millimeters (inches). Angles are in degrees.
Notes:
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and construction.
6. Use 1 oz. Copper minimum.
7.All dimensions are in millimeters (inches). Angles are in degrees.
Data Sheet: Rev A 09/21/10
- 13 of 14
Disclaimer: Subject to change without notice
2010 TriQuint Semiconductor, Inc.
Connecting the Digital World to the Global Network
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