參數(shù)資料
型號(hào): AGP15
廠商: Vishay Intertechnology,Inc.
英文描述: Miniature Glass Passivated Junction Plastic Controlled Avalanche Rectifiers
中文描述: 微型玻璃鈍化結(jié)塑料可控雪崩整流器
文件頁(yè)數(shù): 1/2頁(yè)
文件大小: 30K
代理商: AGP15
AGP15 Series
Vishay Semiconductors
formerly General Semiconductor
Document Number 88535
08-Jul-02
www.vishay.com
1
Miniature Glass Passivated Junction
Plastic Controlled Avalanche Rectifiers
Reverse Voltage
400 to 800V
Forward Current
1.5A
Patented*
Maximum Ratings & Thermal Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Symbol
AGP15-400 AGP15-600 AGP15-800
Unit
Maximum Recurrent Peak Reverse Voltage
V
RRM
400
600
800
V
Maximum RMS voltage
V
RMS
280
420
560
V
Maximum DC blocking voltage
Maximum Peak Power Dissipation in the
Avalanch Region 20
μ
s Pulse
Max. Average Forward Rectified Current 0.375” (9.5mm)
Lead Lengths at T
A
= 55°C
V
DC
400
600
800
V
P
RM
500
W
I
AV
1.5
A
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
I
FSM
50
A
Maximum full load reverse current, full cycle average
0.375" (9.5mm) lead length at T
A
= 55°C
I
R(AV)
100
μ
A
Typical thermal resistance
(Note 1)
R
θ
JA
T
J
, T
STG
25
°C/W
Operating and storage temperature range
–65 to +175
°C
Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwise specified.
Minimum Avalanche Breakdown Voltage at 100
μ
A
Maximum Avalanche Breakdown Voltage at 100
μ
A
Maximum instantaneous forward voltage at 1.5A
V
BR
450
675
880
V
V
BR
750
1000
1200
V
V
F
1.1
V
μ
A
μ
s
pF
Maximum reverse current at rated DC blocking voltage
I
R
5.0
Typical reverse recovery time I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
t
rr
2.0
Typical junction capacitance at 4.0V, 1MHz
C
J
15
Note:
(1) Thermal resistance from junction to ambient at 0.375” (9.5mm) lead length, P.C. Board mounted
DO-204AC
(DO-15)
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
High temp.metallurgically bonded constructed rectifiers
Controlled Avalanche characteristic combined with the
ability to dissipate reverse power
Glass passivated cavity-free junction in DO-15 package
1.5 Ampere operation at T
A
=55°C with no thermal runaway
Typical I
R
less than 0.1
μ
A
Capable of meeting environmental standards of MIL-S-19500
High temperature soldering guaranteed: 350°C/10 seconds,
0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Mechanical Data
Case:
Molded plastic over glass
Terminals:
Plated axial leads, solderable per
MIL-STD-202, Method 208
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.0154 oz., 0.4 g
0.034 (0.86)
0.028 (0.71)
Dia.
0.140 (3.6)
0.104 (2.6)
Dia.
0.230 (5.8)
0.300 (7.6)
1.0 (25.4)
min.
1.0 (25.4)
min.
*
Glass-plastic encapsulation
technique is covered by
Patent No. 3,996,602 of 1976;
brazed-lead assembly by
Patent No. 3,930,306 of 1976
and glass composition by
Patent No. 3,752,701 of 1973
Dimensions in inches
and (millimeters)
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