5-2 Revision 17 Revision 12 (continued) The "Specifying I/O States During Programming" section is new (SAR 34694)." />
參數(shù)資料
型號(hào): AGLN020V2-UCG81I
廠商: Microsemi SoC
文件頁(yè)數(shù): 49/150頁(yè)
文件大?。?/td> 0K
描述: IC FPGA NANO 1KB 20K 81-UCSP
標(biāo)準(zhǔn)包裝: 490
系列: IGLOO nano
邏輯元件/單元數(shù): 520
輸入/輸出數(shù): 52
門(mén)數(shù): 20000
電源電壓: 1.14 V ~ 1.575 V
安裝類(lèi)型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 81-WFBGA,CSBGA
供應(yīng)商設(shè)備封裝: 81-UCSP(4x4)
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)當(dāng)前第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)
Datasheet Information
5-2
Revision 17
Revision 12
(continued)
The reference to guidelines for global spines and VersaTile rows, given in the "Global
Clock Contribution—PCLOCK" section, was corrected to the "Spine Architecture"
section of the Global Resources chapter in the IGLOO nano FPGA Fabric User's
Guide (SAR 34732).
Figure 2-4 has been modified for DIN waveform; the Rise and Fall time label has been
changed to tDIN (37106).
The AC Loading figures in the "Single-Ended I/O Characteristics" section were updated
Settings" section (SAR 34885).
The notes regarding drive strength in the "Summary of I/O Timing Characteristics –
LVCMOS Wide Range" section tables were revised for clarification. They now state that
the minimum drive strength for the default software configuration when run in wide range
is ±100 A. The drive strength displayed in software is supported in normal range only.
For a detailed I/V curve, refer to the IBIS models (SAR 34765).
Added values for minimum pulse width and removed the FRMAX row from Table 2-88
to determine the FRMAX for the device you are using (SAR 36953).
CCC/PLL Specification were updated. A note was added indicating that when the
CCC/PLL core is generated by Mircosemi core generator software, not all delay values
of the specified delay increments are available (SAR 34817).
and
The port names in the SRAM "Timing Waveforms", SRAM "Timing Characteristics"
revised to ensure consistency with the software names (SAR 35754).
Reference was made to a new application note, Simultaneous Read-Write Operations in
Dual-Port SRAM for Flash-Based cSoCs and FPGAs, which covers these cases in detail
(SAR 34865).
The "Pin Descriptions" chapter has been added (SAR 34770).
Package names used in the "Package Pin Assignments" section were revised to match
standards given in Package Mechanical Drawings (SAR 34770).
Revision 11
(Jul 2010)
The status of the AGLN060 device has changed from Advance to Production.
The values for PAC1, PAC2, PAC3, and PAC4 were updated in Table 2-15 Different
1.5 V core supply voltage (SAR 26404).
The values for PAC1, PAC2, PAC3, and PAC4 were updated in Table 2-17 Different
1.2 V core supply voltage (SAR 26404).
July 2010
The versioning system for datasheets has been changed. Datasheets are assigned a
revision number that increments each time the datasheet is revised. The "IGLOO nano
Device Status" table on page II indicates the status for each device in the device family.
N/A
Revision
Changes
Page
相關(guān)PDF資料
PDF描述
AGL060V5-QNG132 IC FPGA 1KB FLASH 60K 132-QFN
A3P030-VQG100 IC FPGA 256MAC 81I/O 100VQFP
AGLN060V2-CSG81 IC FPGA NANO 1KB 60K 81-CSP
RMA44DTBS CONN EDGECARD 88POS R/A .125 SLD
RSA44DTAS CONN EDGECARD 88POS R/A .125 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AGLN020V5-CSG81 功能描述:IC FPGA 20K 1.5V CSP81 RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計(jì):221184 輸入/輸出數(shù):244 門(mén)數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類(lèi)型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA(23x23) 其它名稱(chēng):220-1241
AGLN020V5-CSG81I 功能描述:IC FPGA NANO 1KB 20K 81-CSP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門(mén)數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLN020V5-QNG68 功能描述:IC FPGA 20K 1.5V 68QFN RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計(jì):226304 輸入/輸出數(shù):131 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應(yīng)商設(shè)備封裝:208-PQFP(28x28)
AGLN020V5-QNG68I 功能描述:IC FPGA NANO 1KB 20K 68-QFN RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門(mén)數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應(yīng)商設(shè)備封裝:289-CSP(14x14)
AGLN020V5-UCG81 功能描述:IC FPGA 20K 1.5V UCG81 RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:IGLOO nano 標(biāo)準(zhǔn)包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計(jì):221184 輸入/輸出數(shù):244 門(mén)數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類(lèi)型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應(yīng)商設(shè)備封裝:388-FPBGA(23x23) 其它名稱(chēng):220-1241