IGLOO DC and Switching Characteristics
2-20
Revision 23
User I/O Characteristics
Timing Model
Figure 2-3 Timing Model
Operating Conditions: Std. Speed, Commercial Temperature Range (TJ = 70°C), Worst-Case
VCC = 1.425 V, for DC 1.5 V Core Voltage, Applicable to V2 and V5 Devices
DQ
Y
DQ
Y
Combinational Cell
I/O Module
(Registered)
I/O Module
(Non-Registered)
Register Cell
I/O Module
(Registered)
I/O Module
(Non-Registered)
LVPECL (Applicable to
Advanced I/O Banks Only)L
LVPECL
(Applicable
to Advanced
I/O Banks only)
LVDS,
BLVDS,
M-LVDS
(Applicable for
Advanced I/O
Banks only)
LVTTL 3.3 V Output drive
strength = 12 mA High slew rate
Y
Combinational Cell
Y
Combinational Cell
Y
Combinational Cell
I/O Module
(Non-Registered)
LVTTLOutput drive strength = 8 mA
High slew rate
I/O Module
(Non-Registered)
LVCMOS 1.5 VOutput drive strength = 4 mA
High slew rate
LVTTLOutput drive strength = 12 mA
High slew rate
I/O Module
(Non-Registered)
Input LVTTL
Clock
Input LVTTL
Clock
Input LVTTL
Clock
tPD = 1.22 ns
tPD = 1.20 ns
tDP = 1.72 ns
tPD = 1.80 ns
tDP = 3.05 ns (Advanced I/O Banks)
tPD = 1.49 ns
tDP = 4.12 ns (Advanced I/O Banks)
tPD = 0.86 ns
tDP = 4.42 ns (Advanced I/O Banks)
tPD = 0.92 ns
tPY = 0.87 ns
(Advanced I/O Banks)
tCLKQ = 0.90 ns
tOCLKQ = 1.02 ns
tSUD = 0.82 ns
tOSUD = 0.52 ns
tDP = 3.05 ns
(Advanced I/O Banks)
tPY = 0.87 ns (Advanced I/O Banks)
tPY = 1.35 ns
tCLKQ = 0.90 ns
tSUD = 0.82 ns
tPY = 0.87 ns
(Advanced I/O Banks)
tICLKQ = 0.43 ns
tISUD = 0.47 ns
tPY = 1.20 ns