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參數(shù)資料
| 型號： | AG603-89-RFID |
| 英文描述： | InGaP HBT Gain Block |
| 中文描述： | InGaP HBT增益模塊 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大小： | 489K |
| 代理商： | AG603-89-RFID |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 5 of 6 June 2005
AG603-89
InGaP HBT Gain Block
Product Information
AG603-89G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
°
C reflow temperature) and leaded
(maximum 245
°
C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5.16V, 75 mA at an 85
°
C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177
°
C.
Rating
-40 to +85
°
C
154
°
C/W
145
°
C
Product Marking
The AG603-89G will be marked with an
“A603G” designator. An alphanumeric lot
code (“XXXX-X”) is also marked below the
part designator on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1C
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 3 at +260
°
C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
Passes at 1000 V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes at 1000 V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
MTTF vs. GND Tab Temperature
1
10
100
1000
60
70
80
90
100
110
120
Tab Temperature (°C)
M
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AG604-86-RFID | InGaP HBT Gain Block |
| AG604-86G | InGaP HBT Gain Block |
| AG604-89G | InGaP HBT Gain Block |
| AG604-89PCB | InGaP HBT Gain Block |
| AG604-89-RFID | InGaP HBT Gain Block |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AG603-89TRG | 制造商:TriQuint Semiconductor 功能描述:GAIN BLOCK |
| AG6040P-SM | 制造商:Panasonic Industrial Company 功能描述:SERVICE MANUAL |
| AG6040-SM | 制造商:Panasonic Industrial Company 功能描述:SERVICE MANUAL |
| AG604-86 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:InGaP HBT Gain Block |
| AG604-86G | 功能描述:射頻放大器 DC-6000MHz 20.5dB Gain@900MHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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