- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄64096 > AG602-89G 0 MHz - 3500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER PDF資料下載
參數(shù)資料
| 型號： | AG602-89G |
| 元件分類： | 放大器 |
| 英文描述： | 0 MHz - 3500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | GREEN, SMT, TO-243, SOT-89, 3 PIN |
| 文件頁數(shù)： | 5/5頁 |
| 文件大?。?/td> | 199K |
| 代理商： | AG602-89G |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com, www.TriQuint.com
Page 5 of 5 January 2008
AG602-89
InGaP HBT Gain Block
AG602-89G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
°C reflow temperature) and leaded
(maximum 245
°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Product Marking
The AG602-89G will be marked with an
“A602G” designator with an alphanumeric
lot code marked below the part designator.
The obsolete tin-lead package is marked with
an “AG602” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1C
Value:
Passes
≥ 1000V min.
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes
≥ 1000V min.
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260
°C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink.
Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
A602G
XXXX-X
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AG603-89G | 0 MHz - 3000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AG604-89G | 0 MHz - 2700 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AG606-G | 50 MHz - 860 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AGC-553 | 10 MHz - 500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AGC-7-30/10AC | 25 MHz - 35 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AG602-89PCB | 功能描述:射頻開發(fā)工具 700-2400MHz Eval Brd 18.5dBm 14dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AG602-89-RFID | 制造商:WJCI 制造商全稱:WJCI 功能描述:InGaP HBT Gain Block |
| AG602-89TRG | 制造商:TriQuint Semiconductor 功能描述:GAIN BLOCK |
| AG603 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:InGaP HBT Gain Block |
| AG6030P-SM | 制造商:Panasonic Industrial Company 功能描述:SERVICE MANUAL |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。