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參數(shù)資料
| 型號(hào)： | AG503-89PCB |
| 廠商： | Electronic Theatre Controls, Inc. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; No. of Contacts:8; Series:MS27468; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:17; Circular Contact Gender:Socket; Circular Shell Style:Jam Nut Receptacle; Insert Arrangement:17-8 RoHS Compliant: No |
| 中文描述： | InGaP HBT增益模塊產(chǎn)品信息 |
| 文件頁(yè)數(shù)： | 1/5頁(yè) |
| 文件大?。?/td> | 202K |
| 代理商： | AG503-89PCB |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
June 2003
The Communications Edge
TM
AG503-86
InGaP HBT Gain Block
Product Information
Product Features
DC – 6000 MHz
+16 dBm P1dB at 900 MHz
+29 dBm OIP3 at 900 MHz
20 dB Gain at 900 MHz
Single Voltage Supply
SOT-86 SMT Package
Internally matched to 50
Applications
Mobile Infrastructure
CATV / DBS
W-LAN / ISM
RFID
Defense / Homeland Security
Fixed Wireless
Specifications
Product Description
The AG503-86 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 900 MHz, the AG503-86 typically provides 20
dB of gain, +29 dBm Output IP3, and +16 dBm P1dB. The
device combines dependable performance with consistent
quality to maintain MTTF values exceeding 100 years at
mounting temperatures of +85
°
C and is housed in a SOT-
86 (micro-X) industry-standard SMT package.
The AG503-86 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT technology process
technology and only requires DC-blocking capacitors, a
bias resistor, and an inductive RF choke for operation.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the AG503-86 will work for other various applications
within the DC to 6 GHz frequency range such as CATV
and fixed wireless.
Functional Diagram
Function
Input
Output/Bias
Ground
Pin No.
1
3
2, 4
Parameter
Frequency Range
Gain (900 MHz)
Gain (1900 MHz)
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Output IP2
Noise Figure
Device Voltage
Device Current
Thermal Resistance
Junction Temperature (3)
Units
MHz
dB
dB
dB
dB
dBm
dBm
dBm
dB
V
mA
°
C / W
°
C
Min
DC
16.8
Typ
900
20.2
17.8
20
20
+15.9
+28.8
+37
2.9
5.0
45
Max
6000
18.8
257
177
Test conditions unless otherwise noted.
1. T = 25o C, Supply Voltage = +6 V, R
bias
= 22.1
, Frequency = 900 MHz, 50
System.
2. 3OIP measured with two tones at an output power of 0 dBm/tone separated by 10 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. The junction temperature ensures a minimum MTTF rating of 1 million hours of usage.
Absolute Maximum Rating
Typical Performance
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
Typical
900
20.2
-20
-20
+15.9
+28.8
2.9
500
20.8
-20
-21
+16.0
+28.9
2.9
1900
17.8
-18
-15
+14.6
+27.8
3.1
2140
17.6
-18
-13
+14.3
+27.4
3.1
Test conditions: T = 25o C, Supply Voltage = +6 V, R
bias
= 22.1
, 50
System.
Ordering Information
Parameter
Operating Case Temperature
Storage Temperature
DC Voltage
RF Input Power (continuous)
Junction Temperature
Rating
-40 to +85
°
C
-55 to +125
°
C
+5.8 V
+10 dBm
+250
°
C
Part No.
AG503-86
AG503-86PCB
Description
InGaP HBT Gain Block
700 – 2400 MHz Fully Assembled Eval. Board
Operation of this device above any of these parameters may cause permanent damage.
RF Out
RF In
GND
GND
4
1
2
3
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