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參數(shù)資料
| 型號： | AG303-86G |
| 英文描述： | InGaP HBT Gain Block |
| 中文描述： | InGaP HBT增益模塊 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 500K |
| 代理商： | AG303-86G |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
Page 5 of 6 June 2005
AG303-86
InGaP HBT Gain Block
Product Information
AG303-86 (SOT-86 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
1. The thermal resistance is referenced from the hottest part
of the junction to the ground lead (pin 2 or 4).
2. This corresponds to the typical biasing condition of
+4.23V, 35 mA at an 85
°
C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177
°
C.
Rating
-40 to +85
°
C
335
°
C/W
135
°
C
Product Marking
The component will be marked with an “E”
designator followed by a two-digit numeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1C
Value:
Test:
Standard:
ESD Rating: Level 4
Value:
Test:
Standard:
MSL Rating: Level 1
Standard:
Mounting Config. Notes
Passes at 1000 V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes at 1000 V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020A
1. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25 mm
(.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AG303-86-RFID | InGaP HBT Gain Block |
| AG402-86G | InGaP HBT Gain Block |
| AG402-86PCB | InGaP HBT Gain Block |
| AG402-86-RFID | InGaP HBT Gain Block |
| AG402-86 | Gain Blocks |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AG303-86PCB | 功能描述:射頻開發(fā)工具 700-2400MHz Eval Brd 14dBm 20dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AG303-86-RFID | 制造商:WJCI 制造商全稱:WJCI 功能描述:InGaP HBT Gain Block |
| AG303-86TRG | 制造商:TriQuint Semiconductor 功能描述:GAIN BLOCK |
| AG30N-5 | 功能描述:SINGLE O/P, DC-HV DC PCB MOUNT, 制造商:xp power 系列:XP EMCO - AG 包裝:盒 零件狀態(tài):有效 類型:高電壓 - 隔離模塊 輸出數(shù):1 電壓 - 輸入（最小值）:0.7V 電壓 - 輸入（最大值）:5V 電壓 - 輸出 1:-3000V 電壓 - 輸出 2:- 電壓 - 輸出 3:- 電流 - 輸出（最大值）:330μA 功率（W） - 制造系列:1W 電壓 - 隔離:500V 應(yīng)用:ITE（商業(yè)） 特性:SCP 安裝類型:表面貼裝 封裝/外殼:5-SMD 模塊 大小/尺寸:1.13" 長 x 0.45" 寬 x 0.25" 高（28.7mm x 11.4mm x 6.4mm） 工作溫度:-25°C ~ 75°C 效率:- 功率（W） - 最大值:1W 標(biāo)準(zhǔn)包裝:1 |
| AG30P-12 | 功能描述:SINGLE O/P, DC-HV DC PCB MOUNT, 制造商:xp power 系列:XP EMCO - AG 包裝:盒 零件狀態(tài):有效 類型:高電壓 - 隔離模塊 輸出數(shù):1 電壓 - 輸入（最小值）:0.7V 電壓 - 輸入（最大值）:12V 電壓 - 輸出 1:3000V 電壓 - 輸出 2:- 電壓 - 輸出 3:- 電流 - 輸出（最大值）:330μA 功率（W） - 制造系列:1W 電壓 - 隔離:500V 應(yīng)用:ITE（商業(yè)） 特性:SCP 安裝類型:表面貼裝 封裝/外殼:5-SMD 模塊 大小/尺寸:1.13" 長 x 0.45" 寬 x 0.25" 高（28.7mm x 11.4mm x 6.4mm） 工作溫度:-25°C ~ 75°C 效率:- 功率（W） - 最大值:1W 標(biāo)準(zhǔn)包裝:1 |
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