- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄4456 > AFS250-1FGG256I (Microsemi SoC)IC FPGA 2MB FLASH 250K 256FBGA PDF資料下載
參數(shù)資料
| 型號(hào)： | AFS250-1FGG256I |
| 廠商： | Microsemi SoC |
| 文件頁(yè)數(shù)： | 165/334頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA 2MB FLASH 250K 256FBGA |
| 標(biāo)準(zhǔn)包裝： | 90 |
| 系列： | Fusion® |
| RAM 位總計(jì)： | 36864 |
| 輸入/輸出數(shù)： | 114 |
| 門數(shù)： | 250000 |
| 電源電壓： | 1.425 V ~ 1.575 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 100°C |
| 封裝/外殼： | 256-LBGA |
| 供應(yīng)商設(shè)備封裝： | 256-FPBGA（17x17） |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)當(dāng)前第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)第179頁(yè)第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)第186頁(yè)第187頁(yè)第188頁(yè)第189頁(yè)第190頁(yè)第191頁(yè)第192頁(yè)第193頁(yè)第194頁(yè)第195頁(yè)第196頁(yè)第197頁(yè)第198頁(yè)第199頁(yè)第200頁(yè)第201頁(yè)第202頁(yè)第203頁(yè)第204頁(yè)第205頁(yè)第206頁(yè)第207頁(yè)第208頁(yè)第209頁(yè)第210頁(yè)第211頁(yè)第212頁(yè)第213頁(yè)第214頁(yè)第215頁(yè)第216頁(yè)第217頁(yè)第218頁(yè)第219頁(yè)第220頁(yè)第221頁(yè)第222頁(yè)第223頁(yè)第224頁(yè)第225頁(yè)第226頁(yè)第227頁(yè)第228頁(yè)第229頁(yè)第230頁(yè)第231頁(yè)第232頁(yè)第233頁(yè)第234頁(yè)第235頁(yè)第236頁(yè)第237頁(yè)第238頁(yè)第239頁(yè)第240頁(yè)第241頁(yè)第242頁(yè)第243頁(yè)第244頁(yè)第245頁(yè)第246頁(yè)第247頁(yè)第248頁(yè)第249頁(yè)第250頁(yè)第251頁(yè)第252頁(yè)第253頁(yè)第254頁(yè)第255頁(yè)第256頁(yè)第257頁(yè)第258頁(yè)第259頁(yè)第260頁(yè)第261頁(yè)第262頁(yè)第263頁(yè)第264頁(yè)第265頁(yè)第266頁(yè)第267頁(yè)第268頁(yè)第269頁(yè)第270頁(yè)第271頁(yè)第272頁(yè)第273頁(yè)第274頁(yè)第275頁(yè)第276頁(yè)第277頁(yè)第278頁(yè)第279頁(yè)第280頁(yè)第281頁(yè)第282頁(yè)第283頁(yè)第284頁(yè)第285頁(yè)第286頁(yè)第287頁(yè)第288頁(yè)第289頁(yè)第290頁(yè)第291頁(yè)第292頁(yè)第293頁(yè)第294頁(yè)第295頁(yè)第296頁(yè)第297頁(yè)第298頁(yè)第299頁(yè)第300頁(yè)第301頁(yè)第302頁(yè)第303頁(yè)第304頁(yè)第305頁(yè)第306頁(yè)第307頁(yè)第308頁(yè)第309頁(yè)第310頁(yè)第311頁(yè)第312頁(yè)第313頁(yè)第314頁(yè)第315頁(yè)第316頁(yè)第317頁(yè)第318頁(yè)第319頁(yè)第320頁(yè)第321頁(yè)第322頁(yè)第323頁(yè)第324頁(yè)第325頁(yè)第326頁(yè)第327頁(yè)第328頁(yè)第329頁(yè)第330頁(yè)第331頁(yè)第332頁(yè)第333頁(yè)第334頁(yè)
Fusion Family of Mixed Signal FPGAs
Revision 4
2-231
XTAL2
Crystal Oscillator Circuit Input
Input to crystal oscillator circuit. Pin for connecting external crystal, ceramic resonator, RC network, or
external clock input. When using an external crystal or ceramic oscillator, external capacitors are also
recommended (Please refer to the crystal oscillator manufacturer for proper capacitor value).
If using external RC network or clock input, XTAL1 should be used and XTAL2 left unconnected. In the
case where the Crystal Oscillator block is not used, the XTAL1 pin should be connected to GND and the
XTAL2 pin should be left floating.
Security
Fusion devices have a built-in 128-bit AES decryption core. The decryption core facilitates highly secure,
in-system programming of the FPGA core array fabric and the FlashROM. The FlashROM and the FPGA
core fabric can be programmed independently from each other, allowing the FlashROM to be updated
without the need for change to the FPGA core fabric. The AES master key is stored in on-chip nonvolatile
memory (flash). The AES master key can be preloaded into parts in a security-protected programming
environment (such as the Microsemi in-house programming center), and then "blank" parts can be
shipped to an untrusted programming or manufacturing center for final personalization with an AES-
encrypted bitstream. Late stage product changes or personalization can be implemented easily and with
high level security by simply sending a STAPL file with AES-encrypted data. Highly secure remote field
updates over public networks (such as the Internet) are possible by sending and programming a STAPL
file with AES-encrypted data. For more information, refer to the Fusion Security application note.
128-Bit AES Decryption
The 128-bit AES standard (FIPS-197) block cipher is the National Institute of Standards and Technology
(NIST) replacement for DES (Data Encryption Standard FIPS46-2). AES has been designed to protect
sensitive government information well into the 21st century. It replaces the aging DES, which NIST
adopted in 1977 as a Federal Information Processing Standard used by federal agencies to protect
sensitive, unclassified information. The 128-bit AES standard has 3.4 × 1038 possible 128-bit key
variants, and it has been estimated that it would take 1,000 trillion years to crack 128-bit AES cipher text
using exhaustive techniques. Keys are stored (protected with security) in Fusion devices in nonvolatile
flash memory. All programming files sent to the device can be authenticated by the part prior to
programming to ensure that bad programming data is not loaded into the part that may possibly damage
it. All programming verification is performed on-chip, ensuring that the contents of Fusion devices remain
as secure as possible.
AES decryption can also be used on the 1,024-bit FlashROM to allow for remote updates of the
FlashROM contents. This allows for easy support of subscription model products and protects them with
measures designed to provide the highest level of security available. See the application note Fusion
Security for more details.
AES for Flash Memory
AES decryption can also be used on the flash memory blocks. This provides the best available security
during update of the flash memory blocks. During runtime, the encrypted data can be clocked in via the
JTAG interface. The data can be passed through the internal AES decryption engine, and the decrypted
data can then be stored in the flash memory block.
Programming
Programming can be performed using various programming tools, such as Silicon Sculptor II (BP Micro
Systems) or FlashPro3 (Microsemi).
The user can generate STP programming files from the Designer software and can use these files to
program a device.
Fusion devices can be programmed in-system. During programming, VCCOSC is needed in order to
power the internal 100 MHz oscillator. This oscillator is used as a source for the 20 MHz oscillator that is
used to drive the charge pump for programming.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 5206478-1 | CONN BACKSHELL DB9 PLASTIC |
| GEC43DTES | CONN EDGECARD 86POS .100 EYELET |
| AFS250-1FG256I | IC FPGA 2MB FLASH 250K 256FBGA |
| M1AFS250-1FGG256I | IC FPGA 2MB FLASH 250K 256-FBGA |
| EMC17DTEI | CONN EDGECARD 34POS .100 EYELET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AFS250-1FGG256PP | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:Actel Fusion Mixed-Signal FPGAs |
| AFS250-1PQ208 | 功能描述:IC FPGA 2MB FLASH 250K 208PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Fusion® 標(biāo)準(zhǔn)包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA（17x17） |
| AFS250-1PQ208I | 功能描述:IC FPGA 2MB FLASH 250K 208PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Fusion® 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA（27X27） |
| AFS250-1PQ256ES | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:Actel Fusion Mixed-Signal FPGAs |
| AFS250-1PQ256I | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:Actel Fusion Mixed-Signal FPGAs |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。