Fusion Family of Mixed Signal FPGAs
Revision 4
III
Product Ordering Codes
Fusion Device Status
Notes:
1. For Fusion devices, Quad Flat No Lead packages are only offered as RoHS compliant, QNG packages.
2. MicroBlade and Pigeon Point devices only support FG packages.
Fusion
Status
Cortex-M1
Status
Pigeon Point
Status
MicroBlade
Status
AFS090
Production
AFS250
Production
M1AFS250
Production
U1AFS250
Production
AFS600
Production
M1AFS600
Production
P1AFS600
Production
U1AFS600
Production
AFS1500
Production
M1AFS1500
Production
P1AFS1500
Production
U1AFS1500
Production
M1AFS600
FG
_
Part Number
Fusion Devices
Speed Grade
1
Blank = Standard
1 = 15% Faster than Standard
2 = 25% Faster than Standard
Package Type
QN = Quad Flat No Lead (0.5 mm pitch)
256
I
G
Package Lead Count
Y
Security Feature
Application (junction temperature range)
Blank = Commercial (0 to +85°C)
I = Industrial (–40 to +100°C)
PP = Pre-Production
ES = Engineering Silicon (room temperature only)
90,000 System Gates
AFS090 =
250,000 System Gates
AFS250 =
ARM-Enabled Fusion Devices
600,000 System Gates
AFS600 =
1,500,000 System Gates
AFS1500 =
MicroBlade Devices
250,000 System Gates
U1AFS250 =
600,000 System Gates
U1AFS600 =
1,500,000 System Gates
U1AFS1500 =
Pigeon Point Devices
600,000 System Gates
P1AFS600 =
1,500,000 System Gates
P1AFS1500 =
250,000 System Gates
M1AFS250 =
600,000 System Gates
M1AFS600 =
1,500,000 System Gates
M1AFS1500 =
PQ = Plastic Quad Flat Pack (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
Lead-Free Packaging Options
Blank = Standard Packaging
G = RoHS-Compliant (green) Packaging
1
2
Y = Device Includes License to Implement IP Based on
the Cryptography Research, Inc. (CRI) Patent Portfolio
Blank = Device Does Not Include License to Implement IP Based
on the Cryptography Research, Inc. (CRI) Patent Portfolio