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參數(shù)資料
| 型號(hào)： | AFEM-7780-BLK |
| 元件分類： | 放大器 |
| 英文描述： | 1920 MHz - 1980 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 4 X 7 MM, 1.10 MM HEIGHT, SMT, 20 PIN |
| 文件頁(yè)數(shù)： | 3/15頁(yè) |
| 文件大?。?/td> | 1246K |
| 代理商： | AFEM-7780-BLK |
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11
Handling and Storage
ESD (Electrostatic Discharge)
Electrostatic discharge occurs naturally in the environ-
ment. With the increase in voltage potential, the outlet of
neutralization or discharge will be sought. If the acquired
discharge route is through a semiconductor device, de-
structive damage will result.
ESD countermeasure methods should be developed and
used to control potential ESD damage during handling in
a factory environment at each manufacturing site.
MSL (Moisture Sensitivity Level)
Plastic encapsulated surface mount package is sensitive to
damage induced by absorbed moisture and temperature.
Avago Technologies follows JEDEC Standard J-STD 020B.
Each component and package type is classified for
moisture sensitivity by soaking a known dry package at
various temperatures and relative humidity, and times. Af-
ter soak, the components are subjected to three consecu-
tive simulated reflows.
The out of bag exposure time maximum limits are de-
termined by the classification test describe below which
corresponds to a MSL classification level 6 to 1 according
to the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-
033.
AFEM-7780 is MSL3. Thus, according to the J-STD-033 p.11
the maximum Manufacturers Exposure Time (MET) for this
part is 168 hours. After this time period, the part would
need to be removed from the reel, de-taped and then
re-baked. MSL classification reflow temperature for the
AFEM-7780 is targeted at 260°C +0/-5°C. Figure and table
on following page shows typical SMT profile for maximum
temperature of 260 +0/-5°C.
Moisture Classification Level and Floor Life
MSL Level
Floor Life (out of bag) at factory ambient =< 30°C/60% RH or as stated
1
Unlimited at =< 30°C/85% RH
2
1 year
2a
4 weeks
3
168 hours
4
72 hours
5
48 hours
5a
24 hours
6
Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label
Note :
1. The MSL Level is marked on the MSL Label on each shipping bag.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AFEM-8007-BLK | 功能描述:IC FRONT END 制造商:broadcom limited 系列:* 零件狀態(tài):上次購(gòu)買時(shí)間 標(biāo)準(zhǔn)包裝:1 |
| AFEM-8007-SG1 | 功能描述:IC FRONT END 制造商:broadcom limited 系列:* 零件狀態(tài):上次購(gòu)買時(shí)間 標(biāo)準(zhǔn)包裝:1 |
| AFEM-8007-TR1 | 功能描述:IC FRONT END 制造商:broadcom limited 系列:* 零件狀態(tài):上次購(gòu)買時(shí)間 標(biāo)準(zhǔn)包裝:1,000 |
| AFEM-S102-BLKG | 功能描述:射頻前端 WLAN Front End Module RoHS:否 制造商:Skyworks Solutions, Inc. 類型: 工作頻率:2.4 GHz, 5 GHz 最大數(shù)據(jù)速率:54 Mbps 噪聲系數(shù): 工作電源電壓:3.3 V 電源電流:180 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-32 |
| AFEM-S102-TR1G | 功能描述:射頻前端 WLAN Front End Module RoHS:否 制造商:Skyworks Solutions, Inc. 類型: 工作頻率:2.4 GHz, 5 GHz 最大數(shù)據(jù)速率:54 Mbps 噪聲系數(shù): 工作電源電壓:3.3 V 電源電流:180 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-32 |
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