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參數(shù)資料
| 型號(hào)： | AE235RAA19NJSW |
| 廠商： | COILCRAFT INC |
| 元件分類： | 通用定值電感 |
| 英文描述： | 1 ELEMENT, 0.019 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封裝： | CHIP, 0402 |
| 文件頁數(shù)： | 1/2頁 |
| 文件大?。?/td> | 208K |
| 代理商： | AE235RAA19NJSW |
1102 Silver Lake Road
Cary IL 60013
Phone
Fax
800-981-0363
847-639-1508
E-mail
Web
cp@coilcraft.com
www.coilcraft-cps.com
Coilcraft, Inc. 2009
These parts are preproduction products for electrical evaluation only.
Specification subject to change without notice.
AerospaceGradeChipInductors AE235RAA
0402 CHIP INDUCTORS
Document AE198-1
Revised 07/07/09
AB
C
D
max
ref
E
F
G
H
I
J
0.047
0.025
0.026 0.010 0.020 0.009 0.022 0.026 0.014 0.018
1,19
0,64
0,66
0,25
0,51
0,23
0,56
0,66
0,36
0,46
A
B
overall
C
D
J
F
G
H
E
terminal
Terminal wraparound:
approx 0.007/0,18 both ends
I
Suggested
Land Pattern
Core material Ceramic
Terminations Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature –55°C to +125°C with
Imax current, +125°C
to +155°C with derated current
Storage temperature Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL) +25 to +155 ppm/°C
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging 2000 per 7
″ reel
Paper tape: 8 mm wide, 0.68 mm thick, 2 mm pocket spacing
-40
-55
-20
0
20
40
60
80
100
160
140
120
Ambient temperature (°C)
P
e
rcent
of
rated
rmsI
120
110
100
90
80
70
60
50
40
30
20
10
0
25°C
Current Derating
Typical Q vs Frequency
0
60
50
40
30
20
10
70
80
90
100
110
120
Q
F
actor
1
10
100
1000
10000
Frequency (MHz)
12 nH
19 nH
5.6 nH
27 nH
1 nH
56 nH
Typical L vs Frequency
0
10
20
30
40
50
60
1
10
100
1000
10000
Frequency (MHz)
Inductance
(nH)
27 nH
56 nH
19 nH
12 nH
5.6 nH
1 nH
■ Exceptionally high Q factors
■ Outstanding self-resonant frequency
■ Tight inductance tolerance
■ High temperature materials allow operation in ambient
temperatures up to 155°C.
■ Passes NASA low outgassing specifications
■ Leach-resistant base metalization with tin-lead (Sn-Pb)
terminations ensures the best possible board adhesion
All dimensions are without solder applied to the terminations. For
maximum dimensions with solder, add 0.006 inches / 0,152 mm.
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