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參數(shù)資料
| 型號(hào)： | ADV3003ACPZ-R7 |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 11/16頁(yè) |
| 文件大小： | 0K |
| 描述： | IC EQUALZR HDMI/DVI TMDS 40LFCSP |
| 標(biāo)準(zhǔn)包裝： | 750 |
| 應(yīng)用： | DVI，HDMI 均衡器/驅(qū)動(dòng)器 |
| 接口： | TMDS |
| 電源電壓： | 3 V ~ 3.6 V |
| 封裝/外殼： | 40-VFQFN 裸露焊盤(pán)，CSP |
| 供應(yīng)商設(shè)備封裝： | 40-LFCSP-VQ（6x6） |
| 包裝： | 帶卷 (TR) |
| 安裝類(lèi)型： | 表面貼裝 |
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ADV3003
Rev. 0 | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
AVCC to AVEE
3.7 V
VTTI
AVCC + 0.6 V
VTTO
AVCC + 0.6 V
Internal Power Dissipation
2.0 W
High Speed Input Voltage
AVCC 1.4 V < VIN <
AVCC + 0.6 V
High Speed Differential Input Voltage
2.0 V
Parallel Interface (TX_EN, PE_EN)
AVEE 0.3 V < VIN <
AVCC + 0.6 V
Storage Temperature Range
65°C to +125°C
Operating Temperature Range
40°C to +85°C
Junction Temperature
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a 4-layer JEDEC circuit board for surface-mount
packages. JC is specified for the exposed pad soldered to the
circuit board with no airflow.
Table 3.
Package Type
θJA
θJC
Unit
40-Lead LFCSP
31.9
2.6
°C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the ADV3003
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change
in the stresses exerted on the die by the package. Exceeding a
junction temperature of 175°C for an extended period can result
in device failure. To ensure proper operation, it is necessary to
observe the maximum power derating as determined by the
thermal resistance coefficients.
ESD CAUTION
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