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參數(shù)資料
| 型號： | ADT7301ARMZ-REEL |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 溫度/濕度傳感器 |
| 英文描述： | DIGITAL TEMP SENSOR-SERIAL, 13BIT(s), 4Cel, SQUARE, SURFACE MOUNT |
| 封裝： | LEAD FREE, PLASTIC, MO-187AA, MSOP-8 |
| 文件頁數(shù)： | 10/14頁 |
| 文件大?。?/td> | 637K |
| 代理商： | ADT7301ARMZ-REEL |
Preliminary Technical Data
ADT7301
Rev. PrJ | Page 5 of 14
ABSOLUTE MAXIMUM RATINGS
Table 3. ADT7301 Stress Ratings
Parameter
Rating
VDD to GND
0.3 V to +7 V
Digital Input Voltage to GND
0.3 V to VDD + 0.3 V
Digital Output Voltage to GND
0.3 V to VDD + 0.3 V
Operating Temperature Range1
40°C to +150°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
+150°C
6-Lead SOT-23 (RJ-6)
Power Dissipation2
WMAX = (TJMAX - TA3)/θJA
Thermal Impedance
θJA, Junction-to-Ambient (still air)
190.4°C/W
8-Lead MSOP (RM-8)
Power Dissipation2
WMAX = (TJMAX - TA3)/θJA
Thermal Impedance4
θJA, Junction-to-Ambient (still air)
205.9°C/W
θJC, Junction-to-Case
43.74°C/W
IR Reflow Soldering
Peak Temperature
+220°C (0/+5°C)
Time at Peak Temperature
10 s to 20 s
Ramp-up Rate
2°C/s to 3°C/s
Ramp-down Rate
6°C/sec
1It is not recommended to operate the ADT7301 at temperatures above 125°C
for greater than a total of 5% of the lifetime of the device. Any exposure
beyond this limit will affect device reliability.
2Values relate to package being used on a standard 2-layer PCB. Reference
Figure 3 for a plot of maximum power dissipation versus ambient
temperature (TA).
3TA = ambient temperature
4Junction-to-case resistance is applicable to components featuring a
preferential flow direction, e.g., components mounted on a heat sink.
Junction-to-ambient resistance is more useful for air-cooled, PCB mounted
components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability
0
0.2
0.6
0.4
0.8
1.0
1.2
M
A
XI
M
U
M
PO
WER
D
ISSI
PA
T
IO
N
(
W
)
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
–10
–20
–30
–40
TEMPERATURE (°C)
02884-
0-
003
SOT-23
MSOP
Figure 3. Plot of Maximum Power Dissipation vs. Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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