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參數(shù)資料
| 型號： | ADT7301 |
| 廠商： | Analog Devices, Inc. |
| 元件分類： | 溫度/濕度傳感器 |
| 英文描述： | 13-Bit, 0.5C Accurate, MicroPower Digital Temperature Sensor in 6-Lead SOT-23 |
| 中文描述： | 13位，-0.5℃精確度，微功耗數(shù)字溫度傳感器在6引腳SOT - 23 |
| 文件頁數(shù)： | 5/14頁 |
| 文件大?。?/td> | 637K |
| 代理商： | ADT7301 |
Preliminary Technical Data
ADT7301
ABSOLUTE MAXIMUM RATINGS
Table 3. ADT7301 Stress Ratings
Parameter
V
DD
to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
Operating Temperature Range
1
Storage Temperature Range
Junction Temperature
6-Lead SOT-23 (RJ-6)
Power Dissipation
2
Thermal Impedance
θ
JA
, Junction-to-Ambient (still air)
8-Lead MSOP (RM-8)
Power Dissipation
2
Thermal Impedance
4
θ
JA
, Junction-to-Ambient (still air)
θ
JC
, Junction-to-Case
IR Reflow Soldering
Peak Temperature
Time at Peak Temperature
Ramp-up Rate
Ramp-down Rate
Rev. PrJ | Page 5 of 14
Rating
0.3 V to +7 V
0.3 V to V
DD
+ 0.3 V
0.3 V to V
DD
+ 0.3 V
40°C to +150°C
65°C to +150°C
+150°C
W
MAX
= (T
JMAX
- T
A3
)/θ
JA
190.4°C/W
W
MAX
= (T
JMAX
- T
A3)
/θ
JA
205.9°C/W
43.74°C/W
+220°C (0/+5°C)
10 s to 20 s
2°C/s to 3°C/s
6°C/sec
1
It is not recommended to operate the ADT7301 at temperatures above 125°C
for greater than a total of 5% of the lifetime of the device. Any exposure
beyond this limit will affect device reliability.
2
Values relate to package being used on a standard 2-layer PCB. Reference
Figure 3 for a plot of maximum power dissipation versus ambient
temperature (T
A
).
3
T
A
= ambient temperature
4
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, e.g., components mounted on a heat sink.
Junction-to-ambient resistance is more useful for air-cooled, PCB mounted
components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability
0
0.2
0.6
0.4
0.8
1.0
1.2
M
1
1
1
1
1
1
9
8
7
6
5
4
3
2
1
0
–
–
–
–
TEMPERATURE (°C)
0
SOT-23
MSOP
Figure 3. Plot of Maximum Power Dissipation vs. Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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