
ADT45/ADT50
–6–
REV. 0
TIME – Sec
C
120
60
0
0
10
1
2
3
4
5
6
7
8
9
100
80
40
20
SOT-23 SOLDERED TO 0.338"
3
0.307" Cu PCB
V
1
= 2.7V TO 5V, NO LOAD
Figure 14. Thermal Response Time in Stirred Oil Bath
TIME/DIVISION
0%
10
90
100
1mS
10mV
Figure 15. Temperature Sensor Wideband Output Noise
Voltage. Gain = 100, BW = 157 kHz
FREQUENCY – Hz
2400
1000
010
10k
100
1k
V
H
2200
2000
1600
1800
1400
1200
800
600
400
200
ADT45/ADT50
Figure 16. Voltage Noise Spectral Density vs. Frequency
APPLICAT IONS SE CT ION
Mounting Considerations
If the ADT 45/ADT 50 temperature sensors are thermally at-
tached and protected, they can be used in any temperature mea-
surement application where the maximum temperature range of
the medium is between –40
°
C to +125
°
C. Properly cemented or
glued to the surface of the medium, these sensors will be within
0.01
°
C of the surface temperature. Caution should be exercised
as any wiring to the device can act as heat pipes, introducing
errors if the surrounding air-surface interface is not isothermal.
Avoiding this condition is easily achieved by dabbing the leads of
the temperature sensor and the hookup wires with a bead of
thermally conductive epoxy. T his will ensure that the ADT 45/
ADT 50 die temperature is not affected by the surrounding air
temperature.
T hese temperature sensors, as well as any associated circuitry,
should be kept insulated and dry to avoid leakage and corrosion.
In wet or corrosive environments, any electrically isolated metal
or ceramic well can be used to shield the temperature sensors.
Condensation at very cold temperatures can cause errors and
should be avoided by sealing the device using electrically non-
conductive epoxy paints or dips, or any one of many printed
circuit board coatings and varnishes.
T hermal E nvironment E ffects
T he thermal environment in which the ADT 45/ADT 50 sensors
are used determines two important characteristics: self-heating
effects and thermal response time. Illustrated in Figure 17 is
a thermal model of the ADT 45/ADT 50 temperature sensors,
which is useful in understanding these characteristics.
+
–
C
CH
C
C
T
A
P
D
T
J
u
JC
T
C
u
CA
Figure 17. ADT45/ADT50 Thermal Circuit Model
In the SOT -23 package, the thermal resistance junction-to-case,
θ
JC
, is 180
°
C/W. T he thermal resistance case-to-ambient,
θ
CA
, is
the difference between
θ
JA
and
θ
JC
, and is determined by the
characteristics of the thermal connection. T he temperature
sensor’s power dissipation, represented by P
D
, is the product of
the total voltage across the device and its total supply current
(including any current delivered to the load). T he rise in die
temperature above the medium’s ambient temperature is given
by:
T hus, the die temperature rise of an ADT 45 “RT ” package
mounted into a socket in still air at 25
°
C and driven from a
+5 V supply is less than 0.04
°
C.
T he transient response of the ADT 45/ADT 50 sensors to a step
change in the temperature is determined by the thermal resistances
and the thermal capacities of the die, C
CH
, and the case, C
C
. T he
thermal capacity of the case, C
C
, varies with the measurement
medium since it includes anything that is in direct contact with the
package. In all practical cases, the thermal capacity of the case is
the limiting factor in the thermal response time of the sensor and
can be represented by a single-pole RC-time constant response.
T
J
=
P
D
× θ
JC
+θ
CA
)
+
T
A