參數(shù)資料
型號(hào)： ADSP-BF537BBC-5A
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 23/68頁(yè)
文件大小： 0K
描述： IC DSP CTLR 16BIT 182CSPBGA
產(chǎn)品培訓(xùn)模塊： Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services
標(biāo)準(zhǔn)包裝： 1
系列： Blackfin®
類型： 定點(diǎn)
接口： CAN，SPI，SSP，TWI，UART
時(shí)鐘速率： 500MHz
非易失內(nèi)存： 外部
芯片上RAM： 132kB
電壓 - 輸入/輸出： 2.50V，3.30V
電壓 - 核心： 1.26V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 182-LFBGA，CSPBGA
供應(yīng)商設(shè)備封裝： 182-CSPBGA（12x12）
包裝： 托盤(pán)
配用： ADZS-BF537-ASKIT-ND - BOARD EVAL SKIT ADSP-BF537
ADZS-BFAUDIO-EZEXT-ND - BOARD EVAL AUDIO BLACKFIN
ADZS-BF537-EZLITE-ND - BOARD EVAL ADSP-BF537
ADZS-BFAV-EZEXT-ND - BOARD DAUGHT ADSP-BF533,37,61KIT
ADZS-BF537-STAMP-ND - SYSTEM DEV FOR ADSP-BF537
Rev. J
|
Page 3 of 68
|
February 2014
GENERAL DESCRIPTION
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors are
members of the Blackfin
family of products, incorporating the
Analog Devices, Inc./Intel Micro Signal Architecture (MSA).
Blackfin processors combine a dual-MAC, state-of-the-art sig-
nal processing engine, the advantages of a clean, orthogonal
RISC-like microprocessor instruction set, and single-instruc-
tion, multiple-data (SIMD) multimedia capabilities into a single
instruction-set architecture.
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors are
completely code and pin compatible. They differ only with
respect to their performance, on-chip memory, and presence of
the Ethernet MAC module. Specific performance, memory, and
feature configurations are shown in Table 1.
By integrating a rich set of industry-leading system peripherals
and memory, the Blackfin processors are the platform of choice
for next-generation applications that require RISC-like pro-
grammability, multimedia support, and leading-edge signal
processing in one integrated package.
PORTABLE LOW POWER ARCHITECTURE
Blackfin processors provide world-class power management
and performance. They are produced with a low power and low
voltage design methodology and feature on-chip dynamic
power management, which is the ability to vary both the voltage
and frequency of operation to significantly lower overall power
consumption. This capability can result in a substantial reduc-
tion in power consumption, compared with just varying the
frequency of operation. This allows longer battery life for
portable appliances.
SYSTEM INTEGRATION
The Blackfin processor is a highly integrated system-on-a-chip
solution for the next generation of embedded network-con-
nected applications. By combining industry-standard interfaces
with a high performance signal processing core, cost-effective
applications can be developed quickly, without the need for
costly external components. The system peripherals include an
IEEE-compliant 802.3 10/100 Ethernet MAC (ADSP-BF536 and
ADSP-BF537 only), a CAN 2.0B controller, a TWI controller,
two UART ports, an SPI port, two serial ports (SPORTs), nine
general-purpose 32-bit timers (eight with PWM capability), a
real-time clock, a watchdog timer, and a parallel peripheral
interface (PPI).
BLACKFIN PROCESSOR PERIPHERALS
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors con-
tain a rich set of peripherals connected to the core via several
high bandwidth buses, providing flexibility in system configura-
tion as well as excellent overall system performance (see
Figure 1). The processors contain dedicated network communi-
cation modules and high speed serial and parallel ports, an
interrupt controller for flexible management of interrupts from
the on-chip peripherals or external sources, and power manage-
ment control functions to tailor the performance and power
characteristics of the processor and system to many application
scenarios.
All of the peripherals, except for the general-purpose I/O, CAN,
TWI, real-time clock, and timers, are supported by a flexible
DMA structure. There are also separate memory DMA channels
dedicated to data transfers between the processor’s various
memory spaces, including external SDRAM and asynchronous
memory. Multiple on-chip buses running at up to 133 MHz
provide enough bandwidth to keep the processor core running
along with activity on all of the on-chip and external
peripherals.
The Blackfin processors include an on-chip voltage regulator in
support of the processors’ dynamic power management capabil-
ity. The voltage regulator provides a range of core voltage levels
when supplied from VDDEXT. The voltage regulator can be
bypassed at the user’s discretion.
Table 1. Processor Comparison
Features
ADSP
-BF534
ADSP
-BF536
ADSP
-BF537
Ethernet MAC
—
1
CAN
1
TWI
1
SPORTs
2
UARTs
2
SPI
1
GP Timers
8
Watchdog Timers
1
RTC
1
Parallel Peripheral Interface
1
GPIOs
48
Memory
Configuration
L1 Instruction
SRAM/Cache
16K bytes
16K bytes 16K bytes
L1 Instruction
SRAM
48K bytes
48K bytes 48K bytes
L1 Data
SRAM/Cache
32K bytes
32K bytes 32K bytes
L1 Data SRAM 32K bytes
—
32K bytes
L1 Scratchpad 4K bytes
4K bytes
L3 Boot ROM
2K bytes
Maximum Speed Grade
500 MHz
400 MHz
600 MHz
Package Options:
CSP_BGA
208-Ball
182-Ball
208-Ball
182-Ball
208-Ball
182-Ball
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADSP-BF537BBC-5AV 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述:
ADSP-BF537BBCZ-5A 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC Blackfin processor 500MHz 132KB SRAM RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
ADSP-BF537BBCZ-5A 制造商:Analog Devices 功能描述:Digital Signal Processor IC
ADSP-BF537BBCZ-5AV 功能描述:IC DSP CTLR 16BIT 182CSPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號(hào)處理器） 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤(pán)
ADSP-BF537BBCZ-5AV 制造商:Analog Devices 功能描述:Digital Signal Processor IC
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