參數(shù)資料
型號： ADSP-BF534YBCZ-4B
廠商： Analog Devices Inc
文件頁數(shù)： 56/68頁
文件大小： 0K
描述： IC DSP CTLR 16BIT 400MHZ 208-CSP
產(chǎn)品培訓(xùn)模塊： Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services
標(biāo)準(zhǔn)包裝： 1
系列： Blackfin®
類型： 定點(diǎn)
接口： CAN，SPI，SSP，TWI，UART
時鐘速率： 400MHz
非易失內(nèi)存： 外部
芯片上RAM： 132kB
電壓 - 輸入/輸出： 2.50V，3.30V
電壓 - 核心： 1.20V
工作溫度： -40°C ~ 105°C
安裝類型： 表面貼裝
封裝/外殼： 208-LFBGA，CSPBGA
供應(yīng)商設(shè)備封裝： 208-CSPBGA
包裝： 托盤
Rev. J
|
Page 6 of 68
|
February 2014
memory space, the processor starts executing from the on-chip
boot ROM. For more information, see Booting Modes on
Event Handling
The event controller on the Blackfin processor handles all asyn-
chronous and synchronous events to the processor. The
Blackfin processor provides event handling that supports both
nesting and prioritization. Nesting allows multiple event service
routines to be active simultaneously. Prioritization ensures that
servicing of a higher priority event takes precedence over servic-
ing of a lower priority event. The controller provides support for
five different types of events:
Emulation – An emulation event causes the processor to
enter emulation mode, allowing command and control of
the processor via the JTAG interface.
Reset – This event resets the processor.
Nonmaskable Interrupt (NMI) – The NMI event can be
generated by the software watchdog timer or by the NMI
input signal to the processor. The NMI event is frequently
used as a power-down indicator to initiate an orderly shut-
down of the system.
Exceptions – Events that occur synchronously to program
flow (in other words, the exception is taken before the
instruction is allowed to complete). Conditions such as
data alignment violations and undefined instructions cause
exceptions.
Interrupts – Events that occur asynchronously to program
flow. They are caused by input pins, timers, and other
peripherals, as well as by an explicit software instruction.
Each event type has an associated register to hold the return
address and an associated return-from-event instruction. When
an event is triggered, the state of the processor is saved on the
supervisor stack.
The Blackfin processor event controller consists of two stages:
the core event controller (CEC) and the system interrupt con-
troller (SIC). The core event controller works with the system
interrupt controller to prioritize and control all system events.
Conceptually, interrupts from the peripherals enter into the
SIC, and are then routed directly into the general-purpose inter-
rupts of the CEC.
Figure 3. ADSP-BF534/ADSP-BF536/ADSP-BF537 Memory Maps
RESERVED
CORE MMR REGISTERS (2M BYTES)
RESERVED
SCRATCHPAD SRAM (4K BYTES)
INSTRUCTION BANK B SRAM (16K BYTES)
SYSTEM MMR REGISTERS (2M BYTES)
RESERVED
DATA BANK B SRAM/CACHE (16K BYTES)
DATA BANK B SRAM (16K BYTES)
DATA BANK A SRAM/CACHE (16K BYTES)
ASYNC MEMORY BANK 3 (1M BYTES)
ASYNC MEMORY BANK 2 (1M BYTES)
ASYNC MEMORY BANK 1 (1M BYTES)
ASYNC MEMORY BANK 0 (1M BYTES)
SDRAM MEMORY (16M BYTES TO 512M BYTES)
INSTRUCTION SRAM/CACHE (16K BYTES)
IN
TE
R
N
AL
M
E
M
O
RY
M
A
P
EX
T
E
R
NA
L
M
E
MO
R
YM
A
P
0xFFFF FFFF
0xFFE0 0000
0xFFB0 0000
0xFFA1 4000
0xFFA1 0000
0xFF90 8000
0xFF90 4000
0xFF80 8000
0xFF80 4000
0x2040 0000
0x2030 0000
0x2020 0000
0x2010 0000
0x2000 0000
0xEF00 0000
0x0000 0000
0xFFC0 0000
0xFFB0 1000
0xFFA0 0000
DATA BANK A SRAM (16K BYTES)
0xFF90 0000
0xFF80 0000
RESERVED
0xFFA0 C000
0xFFA0 8000
INSTRUCTION BANK A SRAM (32K BYTES)
RESERVED
BOOT ROM (2K BYTES)
0xEF00 0800
ADSP-BF534/ADSP-BF537 MEMORY MAP
RESERVED
CORE MMR REGISTERS (2M BYTES)
RESERVED
SCRATCHPAD SRAM (4K BYTES)
INSTRUCTION BANK B SRAM (16K BYTES)
SYSTEM MMR REGISTERS (2M BYTES)
RESERVED
DATA BANK B SRAM/CACHE (16K BYTES)
DATA BANK A SRAM/CACHE (16K BYTES)
ASYNC MEMORY BANK 3 (1M BYTES)
ASYNC MEMORY BANK 2 (1M BYTES)
ASYNC MEMORY BANK 1 (1M BYTES)
ASYNCMEMORY BANK0 (1M BYTES)
SDRAM MEMORY (16M BYTES TO 512M BYTES)
INSTRUCTION SRAM/CACHE (16K BYTES)
IN
TE
R
N
A
L
M
E
M
O
R
Y
M
A
P
E
X
TE
R
N
AL
ME
M
O
R
Y
M
AP
0xFFFF FFFF
0xFFE0 0000
0xFFB0 0000
0xFFA1 4000
0xFFA1 0000
0xFF90 8000
0xFF90 4000
0xFF80 8000
0xFF80 4000
0x2040 0000
0x2030 0000
0x2020 0000
0x2010 0000
0x2000 0000
0xEF00 0000
0x0000 0000
0xFFC0 0000
0xFFB0 1000
0xFFA0 0000
0xFF90 0000
0xFF80 0000
RESERVED
0xFFA0 C000
0xFFA0 8000
INSTRUCTION BANK A SRAM (32K BYTES)
RESERVED
BOOT ROM (2K BYTES)
0xEF00 0800
ADSP-BF536 MEMORY MAP
相關(guān)PDF資料
PDF描述
ADSP-21488BSWZ-3A IC DSP 3MBIT 400MHZ 100LQFP
ADSP-BF544MBBCZ-5M IC DSP 16BIT 533MHZ MDDR 400CBGA
SWS600L-5 POWER SUPPLY 5V 120A SGL OUTPUT
ADSP-BF544BBCZ-5A IC DSP 16BIT 533MHZ 400CSBGA
ADSP-21266SKSTZ-2D IC DSP 32BIT 150MHZ 144-LQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADSP-BF535PBB-200 功能描述:IC DSP CONTROLLER 16BIT 260BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號處理器） 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤
ADSP-BF535PBB-300 功能描述:IC DSP CONTROLLER 16BIT 260BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號處理器） 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤
ADSP-BF535PBBZ-200 功能描述:IC DSP CONTROLLER 16BIT 260-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號處理器） 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤
ADSPBF535PKB300 制造商:Analog Devices 功能描述:
ADSP-BF535PKB-300 功能描述:IC DSP CONTROLLER 16BIT 260 BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號處理器） 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*