參數(shù)資料
型號(hào): ADS7883SDBVR
廠商: Texas Instruments
文件頁(yè)數(shù): 5/19頁(yè)
文件大小: 0K
描述: IC ADC 12-BIT 3MSPS SOT23-6
標(biāo)準(zhǔn)包裝: 3,000
位數(shù): 12
采樣率(每秒): 3M
數(shù)據(jù)接口: 串行
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 20mW
電壓電源: 單電源
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: SOT-23-6
供應(yīng)商設(shè)備封裝: SOT-23-6
包裝: 帶卷 (TR)
輸入數(shù)目和類型: 1 個(gè)單端,單極
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
Top-Side Markings
(4)
Samples
ADS7883SBDBVR
ACTIVE
SOT-23
DBV
6
3000
Pb-Free (RoHS
Exempt)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
7883
ADS7883SBDBVT
ACTIVE
SOT-23
DBV
6
250
Pb-Free (RoHS
Exempt)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
7883
ADS7883SDBVR
ACTIVE
SOT-23
DBV
6
3000
Pb-Free (RoHS
Exempt)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
7883
ADS7883SDBVT
ACTIVE
SOT-23
DBV
6
250
Pb-Free (RoHS
Exempt)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
7883
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
相關(guān)PDF資料
PDF描述
VE-BV3-MX-F1 CONVERTER MOD DC/DC 24V 75W
UP050SL6R8K-B-B CAP CER 6.8PF 50V 10% AXIAL
VE-J5P-MW-F4 CONVERTER MOD DC/DC 13.8V 100W
VE-BV2-MX-F4 CONVERTER MOD DC/DC 15V 75W
VE-BV2-MX-F3 CONVERTER MOD DC/DC 15V 75W
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADS7883SDBVT 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 2.7V-5.5V 12B 3MSPS Serial ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
ADS7884 制造商:TI 制造商全稱:Texas Instruments 功能描述:12-BIT, 3-MSPS, MICROPOWER, MINIATURE SAR ANALOG-TO-DIGITAL CONVERTER
ADS7884EVM 功能描述:數(shù)據(jù)轉(zhuǎn)換 IC 開(kāi)發(fā)工具 ADS7884 Eval Mod RoHS:否 制造商:Texas Instruments 產(chǎn)品:Demonstration Kits 類型:ADC 工具用于評(píng)估:ADS130E08 接口類型:SPI 工作電源電壓:- 6 V to + 6 V
ADS7884SDBVR 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 2.7V-5.5V 10B 3MSPS Serial ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
ADS7884SDBVT 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 2.7V-5.5V 10B 3MSPS Serial ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32