參數(shù)資料
型號(hào)： ADS5510I
英文描述： 11-Bit, 125-MSPS Analog-To-Digital Converter
中文描述： 11位，125 MSPS的模擬到數(shù)字轉(zhuǎn)換器
文件頁(yè)數(shù)： 26/30頁(yè)
文件大小： 876K
代理商： ADS5510I
www.ti.com
PowerPAD PACKAGE
The PowerPAD package is a thermally enhanced standard size IC package designed to eliminate the use of
bulky heatsinks and slugs traditionally used in thermal packages. This package can be easily mounted using
standard printed circuit board (PCB) assembly techniques and can be removed and replaced using standard
repair procedures.
Assembly Process
1. Prepare the PCB top-side etch pattern including etch for the leads as well as the thermal pad as
illustrated in the
Mechanical Data
section. The recommended thermal pad dimension is 8 mm x 8 mm.
2. Place a 5-by-5 array of thermal vias in the thermal pad area. These holes should be 13 mils in diameter.
The small size prevents wicking of the solder through the holes.
3. It is recommended to place a small number of 25 mil diameter holes under the package, but outside the
thermal pad area to provide an additional heat path.
4. Connect all holes (both those inside and outside the thermal pad area) to an internal copper plane (such
as a ground plane).
5. Do not use the typical web or spoke via connection pattern when connecting the thermal vias to the
ground plane. The spoke pattern increases the thermal resistance to the ground plane.
6. The top-side solder mask should leave exposed the terminals of the package and the thermal pad area.
7. Cover the entire bottom side of the PowerPAD vias to prevent solder wicking.
8. Apply solder paste to the exposed thermal pad area and all of the package terminals.
ADS5510
SLAS499–JANUARY 2007
The PowerPAD package is designed so that the lead frame die pad (or thermal pad) is exposed on the bottom
of the IC. This provides a low thermal resistance path between the die and the exterior of the package. The
thermal pad on the bottom of the IC can then be soldered directly to the printed circuit board (PCB), using the
PCB as a heatsink.
For more detailed information regarding the PowerPAD package and its thermal properties, see either the
application brief
SLMA004B
(
PowerPAD Made Easy
) or technical brief
SLMA002
(
PowerPAD Thermally
Enhanced Package
).
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADS5510IPAP 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 11-Bit 125 MSPS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類(lèi)型:Differential 信噪比:107 dB 接口類(lèi)型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
ADS5510IPAPG4 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 11B 125 MSPS ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類(lèi)型:Differential 信噪比:107 dB 接口類(lèi)型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
ADS5510IPAPR 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 11-Bit 125 MSPS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類(lèi)型:Differential 信噪比:107 dB 接口類(lèi)型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
ADS5510IPAPRG4 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 11B 125 MSPS ADC RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類(lèi)型:Differential 信噪比:107 dB 接口類(lèi)型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
ADS-5512 功能描述:DC/DC轉(zhuǎn)換器 51W 12V/3A, 5V/3A DC/DC RoHS:否 制造商:Murata 產(chǎn)品: 輸出功率: 輸入電壓范圍:3.6 V to 5.5 V 輸入電壓（標(biāo)稱(chēng)）: 輸出端數(shù)量:1 輸出電壓（通道 1）:3.3 V 輸出電流（通道 1）:600 mA 輸出電壓（通道 2）: 輸出電流（通道 2）: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體尺寸:
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