參數(shù)資料
型號(hào): ADP3339
廠商: Analog Devices, Inc.
元件分類: 基準(zhǔn)電壓源/電流源
英文描述: Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection
中文描述: 無(wú)電容,NMOS管,150mA的低壓差穩(wěn)壓器的反向電流保護(hù)
文件頁(yè)數(shù): 7/8頁(yè)
文件大?。?/td> 209K
代理商: ADP3339
REV. 0
ADP3339
–7–
CALCULATING POWER DISSIPATION
Device power dissipation is calculated as follows:
(
Where
I
LOAD
and
I
GND
are load current and ground current,
V
IN
and
V
OUT
are the input and output voltages respectively.
Assuming worst-case operating conditions are I
LOAD
= 1.5 A,
I
GND
= 14 mA, V
IN
= 3.3 V, and V
OUT
= 2.5 V, the device power
dissipation is:
D
=
(
3 3
2 5
1500
.
.
So, for a maximum junction temperature of 125
°
C and a
maximum ambient temperature of 85
°
C, the required ther-
mal resistance from junction to ambient is:
P
V
V
I
V
I
D
IN
OUT
LOAD
IN
GND
=
)
×
+
(
)
×
P
V
V
mA
V
mA
mW
)
+
(
)
=
3 3
.
14
1246
θ
J
A
C
°
1 246
C
°
W
C W
/
=
=
°
125
85
32 1
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
The SOT-223
s thermal resistance,
θ
JA
, is determined by the
sum of the junction-to-case and the case-to-ambient thermal
resistances. The junction-to-case thermal resistance,
θ
JC
, is
determined by the package design and specified at 26.8
°
C/W.
However, the case-to-ambient thermal resistance is determined
by the printed circuit board design.
As shown in Figures 4a
4c, the amount of copper to which the
ADP3339 is mounted affects the thermal performance. When
mounted to just the minimal pads of 2 oz. copper (Figure 4a),
the
θ
JA
is 126.6
°
C/W. By adding a small copper pad under the
ADP3339 (Figure 4b), reduces the
θ
JA
to 102.9
°
C/W. Increasing
the copper pad to 1 square inch (Figure 4c), reduces the
θ
JA
even further to 52.8
°
C/W.
a.
b.
c.
Figure 4. PCB Layouts
Use the following general guidelines when designing printed
circuit boards:
1. Keep the output capacitor as close to the output and ground
pins as possible.
2. Keep the input capacitor as close to the input and ground
pins as possible.
3. PC board traces with larger cross sectional areas will remove
more heat from the ADP3339. For optimum heat transfer,
specify thick copper and use wide traces.
4. The thermal resistance can be decreased by adding a copper
pad under the ADP3339 as shown in Figure 4b.
5. If possible, utilize the adjacent area to add more copper
around the ADP3339. Connecting the copper area to the
output of the ADP3339, as shown in Figure 4c, is best but
will improve thermal performance even if it is connected to
other pins.
6. Use additional copper layers or planes to reduce the thermal
resistance. Again, connecting the other layers to the output
of the ADP3339 is best, but not necessary. When connecting
the output pad to other layers use multiple vias.
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