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參數(shù)資料
| 型號： | ADP3333ARM-277 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | Li-Ion AND Li-Pol Battery Gas Gauge IC for Portable Applications (bqJUNIOR) 10-VSON |
| 中文描述： | 高精度超低智商，300毫安，anyCAP低壓差穩(wěn)壓器 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大小： | 119K |
| 代理商： | ADP3333ARM-277 |
REV. 0
ADP3333
–7–
Calculating Junction T emperature
Device power dissipation is calculated as follows:
(
Where
I
LOAD
and
I
GND
are load current and ground current,
V
IN
and
V
OUT
are the input and output voltages respectively.
Assuming the worst-case operating conditions are I
LOAD
=
300 mA, I
GND
= 2.6 mA, V
IN
= 4.0 V and V
OUT
= 3.0 V, the
device power dissipation is:
(
T he package used on the ADP3333 has a thermal resistance of
158
°
C/W for 4-layer boards. T he junction temperature rise
above ambient will be approximately equal to:
P
V
V
I
V
I
D
IN
OUT
LOAD
IN
GND
=
)
+
(
)
P
V
V
mA
V
mA
mW
D
=
)
+
(
)
=
4 0
.
3 0
.
300
4 2
.
2 0
.
308
T
W
C W
°
C
A
J
=
×
=
°
0 308
.
158
48 7
/
.
So, to limit the junction temperature to 125
°
C, the maximum
allowable ambient temperature is:
T
C
C
C
MAX
A
(
)
.
.
=
°
°
=
°
125
48 7
76 3
Shutdown Mode
Applying a high signal to the shutdown pin, or connecting it to
the input pin, will turn the output ON. Pulling the shutdown
pin to 0.3 V or below, or connecting it to ground, will turn the
output OFF. In shutdown mode, the quiescent current is reduced
to less than 1
μ
A.
Printed Circuit Board Layout Considerations
Use the following general guidelines when designing printed
circuit boards:
1. K eep the output capacitor as close to the output and ground
pins as possible.
2. K eep the input capacitor as close to the input and ground
pins as possible.
3. PC board traces with larger cross sectional areas will remove
more heat from the ADP3333. For optimum heat transfer,
specify thick copper and use wide traces.
4. Connect the NC pins (Pins 5, 6, and 8) to ground for better
thermal performance.
5. T he thermal resistance can be decreased by approximately
10% by adding a few square centimeters of copper area to
the lands connected to the pins of the LDO.
6. Use additional copper layers or planes to reduce the thermal
resistance. Again, connecting the other layers to the ground and
NC pins of the ADP3333 is best, but not necessary. When
connecting the ground pad to other layers use multiple vias.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADP3333ARM-3 | 制造商:Analog Devices 功能描述: |
| ADP3333ARM-3.15 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog IC |
| ADP3333ARM-3.15-R7 | 制造商:Analog Devices 功能描述:LDO Regulator Pos 3.15V 0.6A 8-Pin MSOP T/R 制造商:Rochester Electronics LLC 功能描述:300MA FIXED ANYCAP LDO - Bulk |
| ADP3333ARM-3.15-RL | 制造商:Analog Devices 功能描述:LDO Regulator Pos 3.15V 0.6A 8-Pin MSOP T/R 制造商:Rochester Electronics LLC 功能描述:300MA FIXED ANYCAP LDO - Bulk |
| ADP3333ARM-3.3 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog IC |
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