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參數(shù)資料
| 型號： | ADN2890ACPZ-RL7 |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 2/12頁 |
| 文件大小： | 0K |
| 描述： | IC AMP LIM 16LFCSP |
| 標準包裝： | 1 |
| 放大器類型： | 限制 |
| 電路數(shù)： | 1 |
| 輸出類型： | 差分 |
| 電壓 - 輸入偏移： | 100µV |
| 電流 - 電源： | 39mA |
| 電壓 - 電源，單路/雙路(±)： | 3 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-VFQFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 16-LFCSP-VQ |
| 包裝： | 標準包裝 |
| 產(chǎn)品目錄頁面： | 788 (CN2011-ZH PDF) |
| 其它名稱： | ADN2890ACPZ-RL7DKR |
ADN2890
Data Sheet
Rev. A | Page 10 of 12
PCB Layout
Figure 9 shows a recommended PC board layout. Use of 50
transmission lines is required for all high frequency input and
output signals to minimize reflections: PIN, NIN, OUTP and
OUTN. It is also necessary for the PIN/NIN input traces to be
matched in length, and OUTP/OUTN output traces to be matched
in length to avoid skew between the differential traces. C1, C2,
C3, and C4 are ac-coupling capacitors in series with the high
speed I/O. It is recommended that components be used such
that the pad for the capacitor is the same width as the transmission
line in order to minimize the mismatch in the 50 transmission
line at the capacitor’s pads. It is recommended that the trans-
mission lines not change layers through vias, if possible. For
supply decoupling, the 1 nF decoupling capacitor should be
placed on the same layer as the ADN2890 as close as possible to
the VCC pin. The 0.1 F capacitor can be placed on the bottom
of the PCB directly underneath the 1 nF decoupling capacitor.
All high speed CML outputs are back-terminated on chip with
50 resistors connected between the output pin and VCC. The
high speed inputs, PIN and NIN, are internally terminated with
50 to an internal reference voltage.
As with any high speed mixed-signal design, take care to keep
all high speed digital traces away from sensitive analog nodes.
Soldering Guidelines for Chip Scale Package
The lands on the 16 LFCSP are rectangular. The printed circuit
board pad for these should be 0.1 mm longer than the package
land length and 0.05 mm wider than the package land width.
The land should be centered on the pad. This ensures that the
solder joint size is maximized. The bottom of the chip scale
package has a central exposed pad. The pad on the printed
circuit board should be at least as large as this exposed pad. The
user must connect the exposed pad to VEE using filled vias so
that solder does not leak through the vias during reflow. This
ensures a solid connection from the exposed pad to VEE.
Figure 9. Recommended ADN2890 PCB Layout
04509-0-008
1
VIAS TO
GND
EXPOSED PAD
PIN
NIN
VIA TO C12, R2
ON BOTTOM
C11
VIA TO BOTTOM
DOUBLE-VIA TO GND
TO REDUCE INDUCTANCE
C3
C8
C4
C1
C6
C2
OUTP
DOUBLE-VIAS TO REDUCE
INDUCTANCE TO SUPPLY
AND GND
R1, C9, C10 ON BOTTOM
TO ROSA
PLACE C7 ON
BOTTOM OF BOARD
UNDERNEATH C8
OUTN
PLACE C5 ON
BOTTOM OF BOARD
UNDERNEATH C6
4mm
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| ADN2891ACPZ-500RL7 | 功能描述:IC AMP LIM 16LFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:1 系列:MicroAmplifier™ 放大器類型:通用 電路數(shù):4 輸出類型:- 轉(zhuǎn)換速率:3.5 V/µs 增益帶寬積:1MHz -3db帶寬:- 電流 - 輸入偏壓:5pA 電壓 - 輸入偏移:1500µV 電流 - 電源:220µA 電流 - 輸出 / 通道:60mA 電壓 - 電源，單路/雙路(±):4.5 V ~ 36 V，±2.25 V ~ 18 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:14-SOIC 包裝:剪切帶 (CT) 其它名稱:296-29363-1 |
| ADN2891ACPZ-RL | 功能描述:IC AMP LIM 16LFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:50 系列:- 放大器類型:J-FET 電路數(shù):2 輸出類型:- 轉(zhuǎn)換速率:13 V/µs 增益帶寬積:3MHz -3db帶寬:- 電流 - 輸入偏壓:65pA 電壓 - 輸入偏移:3000µV 電流 - 電源:1.4mA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):7 V ~ 36 V，±3.5 V ~ 18 V 工作溫度:-40°C ~ 85°C 安裝類型:通孔 封裝/外殼:8-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:8-PDIP 包裝:管件 |
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