參數(shù)資料
型號(hào)： ADM237LARZ
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 7/20頁(yè)
文件大?。?/td> 0K
描述： IC TXRX RS-232 5:3 5V LP 24SOIC
標(biāo)準(zhǔn)包裝： 31
類(lèi)型： 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù)： 4/3
規(guī)程： RS232
電源電壓： 4.75 V ~ 5.25 V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 24-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 24-SOIC W
包裝： 管件
ADM231L–ADM234L/ADM236L–ADM241L
Rev. C | Page 15 of 20
16
18
9
0.310 (7.87)
0.220 (5.59)
PIN 1
0.005
(0.13)
MIN
0.098 (2.49)
MAX
15°
0°
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
SEATING
PLANE
0.200 (5.08)
MAX
0.840 (21.34) MAX
0.150 (3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.100
(2.54)
BSC
0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 36. 16-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-16)
Dimensions shown in inches and (millimeters)
20
1
10
11
0.985 (25.02)
0.965 (24.51)
0.945 (24.00)
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
SEATING
PLANE
0.015 (0.38) MIN
0.180 (4.57)
MAX
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.100
(2.54)
BSC
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095-AE
Figure 37. 20-Lead Plastic Dual In-Line Package [PDIP]
(N-20)
Dimensions shown in inches and (millimeters)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AC
0.75 (0.0295)
0.25 (0.0098)
20
11
10
1
8°
0°
× 45°
1.27 (0.0500)
0.40 (0.0157)
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
2.65 (0.1043)
2.35 (0.0925)
0.33 (0.0130)
0.20 (0.0079)
1.27
(0.0500)
BSC
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
13.00 (0.5118)
12.60 (0.4961)
COPLANARITY
0.10
Figure 38. 20-Lead Standard Small Outline Package [SOIC]
Wide Body (R-20)
Dimensions shown in millimeters and (inches)
20
110
11
0.310 (7.87)
0.220 (5.59)
PIN 1
0.005
(0.13)
MIN
0.098 (2.49)
MAX
15°
0°
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
SEATING
PLANE
0.200 (5.08)
MAX
1.060 (26.92) MAX
0.150 (3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.100
(2.54)
BSC
0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 39. 20-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-20)
Dimensions shown in inches and (millimeters)
24
112
13
1.185 (30.01)
1.165 (29.59)
1.145 (29.08)
0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
SEATING
PLANE
0.015 (0.38) MIN
0.180
(4.57)
MAX
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.110 (2.79)
0.100
(2.54)
BSC
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095AG
Figure 40. 24-Lead Plastic Dual In-Line Package [PDIP]
(N-24-1)
Dimensions shown in inches and (millimeters)
SEATING
PLANE
0.023 (0.58)
0.014 (0.36)
0.075 (1.91)
0.015 (0.38)
0.225 (5.72)
MAX
0.200 (5.08)
0.120 (3.05)
0.070 (1.78)
0.030 (0.76)
0.150
(3.81)
MIN
1.290 (32.77) MAX
0.100 (2.54)
BSC
24
2
1
13
0.610 (15.49)
0.500 (12.70)
PIN 1
0.098 (2.49) MAX
0.005 (0.13) MIN
0.620 (15.75)
0.590 (14.99)
0.015 (0.38)
0.008 (0.20)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 41. 24-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
(D-24-2)
Dimensions shown in inches and (millimeters)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADM237LARZ-REEL 功能描述:IC TXRX RS-232 5:3 5V LP 24SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:121 系列:- 類(lèi)型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):1/1 規(guī)程:RS422，RS485 電源電壓:3 V ~ 3.6 V 安裝類(lèi)型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:10-DFN（3x3） 包裝:管件
ADM237LJN 功能描述:IC TXRX RS-232 5:3 5V LP 24DIP RoHS:否 類(lèi)別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:27 系列:- 類(lèi)型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):3/3 規(guī)程:RS232，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類(lèi)型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件
ADM237LJNZ 功能描述:IC TXRX RS-232 5:3 5V LP 24-DIP RoHS:是 類(lèi)別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:27 系列:- 類(lèi)型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):3/3 規(guī)程:RS232，RS485 電源電壓:4.75 V ~ 5.25 V 安裝類(lèi)型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件
ADM237LJR 制造商:Analog Devices 功能描述:Quint Transmitter Triple Receiver RS-232 24-Pin SOIC W 制造商:Rochester Electronics LLC 功能描述:RS-232 CIRCUIT - Bulk
ADM237LJR-REEL 功能描述:IC TXRX RS-232 5:3 5V LP 24SOIC RoHS:否 類(lèi)別:集成電路 (IC) >> 接口 - 驅(qū)動(dòng)器，接收器，收發(fā)器 系列:- 標(biāo)準(zhǔn)包裝:121 系列:- 類(lèi)型:收發(fā)器 驅(qū)動(dòng)器/接收器數(shù):1/1 規(guī)程:RS422，RS485 電源電壓:3 V ~ 3.6 V 安裝類(lèi)型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:10-DFN（3x3） 包裝:管件
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