Data Sheet
ADG801/ADG802
Rev. B | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to GND
0.3 V to +7 V
0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Continuous Current, Pin S or Pin D
400 mA
Peak Current, Pin S or Pin D
800 mA, pulsed at 1 ms,
10% duty cycle max
Operating Temperature Range
Automotive
40°C to +125°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (TJMAX)
150°C
Package Power Dissipation
(TJMAX – TA)/θJA
MSOP
θJA Thermal Impedance
206°C/W
θJC Thermal Impedance
44°C/W
SOT-23 (4-Layer Board)
θJA Thermal Impedance
119°C/W
θJC Thermal Impedance
91.99°C/W
Lead Temperature, Soldering
(10 sec)
300°C
IR Reflow, Peak Temperature
(<20 sec)
235°C
Reflow Soldering (Pb-Free)
Peak Temperature
260(+0/5)°C
Time at Peak Temperature
10 sec to 40 sec
1 Overvoltages at Pin IN, Pin S, or Pin D are clamped by internal diodes.
Current should be limited to the maximum ratings provided.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 4. Truth Table
ADG801 (Pin IN)
ADG802 (Pin IN)
Switch Condition
0
1
Off
1
0
On
ESD CAUTION