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ADG787
Rev. A | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to GND
0.3 V to +6 V
Analog Inputs
1, Digital Inputs
0.3 V to VDD + 0.3 V or
30 mA (whichever
occurs first)
Peak Current, S or D
5 V Operation
300 mA
3.3 V Operation
200 mA (pulsed at 1 ms,
10% duty cycle max)
Continuous Current, S or D
5 V Operation
100 mA
3.3 V Operation
80 mA
Operating Temperature Range
Extended Industrial (B Version)
MSOP and LFCSP packages
40°C to +85°C
Industrial (B version)
WLCSP package
25°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
WLCSP Package (4-Layer Board)
θJA Thermal Impedance
120°C/W
LFCSP Package (4-Layer Board)
θJA Thermal Impedance
61°C/W
MSOP Package (4-Layer Board)
θJA Thermal Impedance
142°C/W
θJC Thermal Impedance
43.7°C/W
Lead-Free Temperature Soldering
IR Reflow, Peak Temperature
Peak Temperature
260(+0/5)°C
Time at Peak Temperature
10 sec to 40 sec
1 Overvoltages at the IN, S, or D pins are clamped by internal diodes. Current
should be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any one
time.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.