參數(shù)資料
型號(hào): ADG659YRU
廠商: Analog Devices Inc
文件頁數(shù): 13/20頁
文件大?。?/td> 0K
描述: IC MULTIPLEXER DUAL 4X1 16TSSOP
產(chǎn)品培訓(xùn)模塊: Switch Fundamentals
標(biāo)準(zhǔn)包裝: 96
功能: 多路復(fù)用器
電路: 2 x 4:1
導(dǎo)通狀態(tài)電阻: 150 歐姆
電壓電源: 單/雙電源
電壓 - 電源,單路/雙路(±): 2 V ~ 12 V,±2 V ~ 6 V
電流 - 電源: 10nA
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 16-TSSOP(0.173",4.40mm 寬)
供應(yīng)商設(shè)備封裝: 16-TSSOP
包裝: 管件
ADG658/ADG659
Rev. B | Page 20 of 20
16
9
8
1
PIN 1
SEATING
PLANE
0.010
0.004
0.012
0.008
0.025
BSC
0.010
0.006
0.050
0.016
COPLANARITY
0.004
0.065
0.049
0.069
0.053
0.154
BSC
0.236
BSC
COMPLIANT TO JEDEC STANDARDS MO-137AB
0.193
BSC
Figure 34. 16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ADG658YRU
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG658YRU-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG658YRUZ1
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG658YRUZ-REEL71
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG658YCP
40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP]
CP-16
ADG658YCP-REEL7
40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP]
CP-16
ADG658YCPZ1
40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP]
CP-16
ADG658YRQ
40°C to +125°C
16-Lead Shrink Small Outline Package [QSOP]
RQ-16
ADG658YRQ-REEL
40°C to +125°C
16-Lead Shrink Small Outline Package [QSOP]
RQ-16
ADG658YRQZ1
40°C to +125°C
16-Lead Shrink Small Outline Package [QSOP]
RQ-16
ADG658YRQZ-REEL71
40°C to +125°C
16-Lead Shrink Small Outline Package [QSOP]
RQ-16
ADG659YRU
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG659YRU-REEL7
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG659YRUZ1
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG659YRUZ-REEL71
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG659WYRUZ-REEL71, 2
40°C to +125°C
16-Lead Thin Shrink Small Outline Package [TSSOP]
RU-16
ADG659YCP
40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP]
CP-16
ADG659YCPZ1
40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP]
CP-16
ADG659YCPZ-REEL71
40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP]
CP-16
ADG659YRQ
40°C to +125°C
16-Lead Shrink Small Outline Package [QSOP]
RQ-16
ADG659YRQ-REEL
40°C to +125°C
16-Lead Shrink Small Outline Package [QSOP]
RQ-16
ADG659YRQ-REEL7
40°C to +125°C
16-Lead Shrink Small Outline Package [QSOP]
RQ-16
ADG659YRQZ1
40°C to +125°C
16-Lead Shrink Small Outline Package [QSOP]
RQ-16
1 Z = RoHS Compliant Part.
2 Qualified for automotive.
2004–2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03273-0-2/09(B)
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