VDD 1
參數(shù)資料
型號: ADG602BRMZ-REEL7
廠商: Analog Devices Inc
文件頁數(shù): 9/12頁
文件大?。?/td> 0K
描述: IC SWITCH SPST 8MSOP
產(chǎn)品培訓(xùn)模塊: Switch Fundamentals
標(biāo)準(zhǔn)包裝: 1,000
功能: 開關(guān)
電路: 1 x SPST- NC
導(dǎo)通狀態(tài)電阻: 5 歐姆
電壓電源: 單/雙電源
電壓 - 電源,單路/雙路(±): 2.7 V ~ 5.5 V,±2.7 V ~ 5.5 V
電流 - 電源: 1nA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 8-MSOP
包裝: 帶卷 (TR)
ADG601/ADG602
Rev. C | Page 6 of 12
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
VDD 1
S 2
VSS 3
IN
6
D
5
GND
4
ADG601/
ADG602
TOP VIEW
(Not to Scale)
0
261
9-
002
PIN 1
INDICATOR
D 1
NC 2
NC 3
VDD 4
S
8
GND
7
IN
6
VSS
5
NC = NO CONNECT
ADG601/
ADG602
TOP VIEW
(Not to Scale)
0
2619
-003
PIN 1
INDICATOR
02
619
-0
21
1
2
3
4
5
6
7
14
TOP VIEW
(Not to Scale)
13
12
11
10
9
8
Figure 2. 6-Lead SOT-23 (RJ-6)
Figure 3. 8-Lead MSOP (RM-8)
Figure 4. Die (820 μm × 2255 μm)
Table 5. Pin Function Descriptions
Pin No.
6-Lead SOT-23
8-Lead MSOP
Mnemonic
Description
1
4
VDD
Most Positive Power Supply Potential.
2
8
S
Source Terminal. Can be an input or output.
3
5
VSS
Most Negative Power Supply Potential.
4
7
GND
Ground (0 V) Reference.
5
1
D
Drain Terminal. Can be an input or output.
6
IN
Logic Control Input.
N/A
2, 3
NC
No Connect.
Table 6. Die Pad Coordinates1
Die Pad
Coordinates
Die Pad No.
X (μm)
Y (μm)
Mnemonic
Description
1
265
+754
NC
No Connect.
2
265
+525
D
Drain Terminal. Can be an input or output.2
3
265
+241
D
Drain Terminal. Can be an input or output.2
4
265
+141
D
Drain Terminal. Can be an input or output.2
5
265
191
NC
No Connect.
6
265
409
NC
No Connect.
7
265
549
NC
No Connect.
8
265
787
VDD
Most Positive Power Supply Potential.
9
+265
767
VSS
Most Negative Power Supply Potential.
10
+265
429
IN
Logic Control Input.
11
+265
289
GND
Ground (0 V) Reference.
12
+265
+189
S
Source Terminal. Can be an input or output.3
13
+265
+521
S
Source Terminal. Can be an input or output.3
14
+265
+661
NC
Source Terminal. Can be an input or output.
1 Measured from the center of the die.
2 Bond the D pads together to a single point to preserve the on resistance and current handling capability. The common point acts as the drain pin of the switch.
3 Bond the S pads together to a single point to preserve the on resistance and current handling capability. The common point acts as the source pin of the switch.
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