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參數(shù)資料
| 型號： | ADG509FBRWZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 17/20頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MULTIPLEXER DUAL 4X1 16SOIC |
| 產(chǎn)品培訓(xùn)模塊： | Switch Fundamentals |
| 標準包裝： | 47 |
| 功能： | 多路復(fù)用器 |
| 電路： | 2 x 4:1 |
| 導(dǎo)通狀態(tài)電阻： | 300 歐姆 |
| 電壓電源： | 雙電源 |
| 電壓 - 電源，單路/雙路(±)： | ±15V |
| 電流 - 電源： | 100nA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 16-SOIC W |
| 包裝： | 管件 |
ADG508F/ADG509F/ADG528F
Rev. E | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
TA = +25°C unless otherwise noted.
Table 5.
Parameter
Rating
VDD to VSS
44 V
VDD to GND
0.3 V to +25 V
VSS to GND
+0.3 V to 25 V
Digital Input, EN, Ax
0.3 V to VDD + 2 V or 20 mA,
whichever occurs first
VS, Analog Input Overvoltage with
Power On
VSS 25 V to VDD + 40 V
VS, Analog Input Overvoltage with
Power Off
40 V to +55 V
Continuous Current, S or D
20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle Max)
40 mA
Operating Temperature Range
Industrial (B Version)
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
TSSOP
θJA, Thermal Impedance
112°C/W
Plastic Package
θJA, Thermal Impedance
16-Lead
117°C/W
18-Lead
110°C/W
Lead Temperature, Soldering (10 sec)
260°C
SOIC Package
θJA, Thermal Impedance
Narrow Body
77°C/W
Wide Body
75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
PLCC Package
θJA, Thermal Impedance
90°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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